NXP Semiconductors - CT914B/HM

  1. Home
  2. NXP Semiconductors - CT914B/HM
CT914B/HM by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number CT914B/HM
Description CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Qualification: Not Qualified; Surface Mount: NO; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
Datasheet CT914B/HM Datasheet
In Stock1,687
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
No. of Functions: 1
Qualification: Not Qualified
Terminal Position: UNSPECIFIED
Telecom IC Type: CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Package Style (Meter): MICROELECTRONIC ASSEMBLY
JESD-30 Code: X-XXMA-X
Package Shape: UNSPECIFIED
Terminal Form: UNSPECIFIED
Surface Mount: NO
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,687 - -

Popular Products

Category Top Products

PCD5090HZ-T by NXP Semiconductors

PCD5090HZ-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
TA31137FNG by Toshiba

TA31137FNG

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31101F-TP2 by Toshiba

TA31101F-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
TA31101AF by Toshiba

TA31101AF

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
SC14441C52R101QNC by Renesas Electronics

SC14441C52R101QNC

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G; Technology: CMOS; Terminal Position: QUAD;
TEA1118M-T by NXP Semiconductors

TEA1118M-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
935220650512 by NXP Semiconductors

935220650512

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
KA3361CD by Samsung

KA3361CD

Samsung

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TA31136FN-TP1 by Toshiba

TA31136FN-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
TG2401F by Toshiba

TG2401F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: HTSSOP; Package Shape: RECTANGULAR;
TA2056FN by Toshiba

TA2056FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31103FN(ER) by Toshiba

TA31103FN(ER)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LSSOP; Package Shape: RECTANGULAR;
TEA1118TD by NXP Semiconductors

TEA1118TD

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
PCD50912H-T by NXP Semiconductors

PCD50912H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
SA58641DK by NXP Semiconductors

SA58641DK

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31136N by Toshiba

TA31136N

Toshiba

Cordless Telephone ICs; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TA31101P by Toshiba

TA31101P

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SC14441B52RLTX by Renesas Electronics

SC14441B52RLTX

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Nominal Supply Voltage: 1.8 V; Package Body Material: UNSPECIFIED; JESD-30 Code: R-XQCC-N;
KA8509 by Samsung

KA8509

Samsung

Cordless Telephone ICs; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR;
953220650518 by NXP Semiconductors

953220650518

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;