Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.0048 Mbps |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.0048 Mbps |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN/NICKEL PALLADIUM GOLD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e3/e4 |
40 |
260 |
11.4808 mm |
||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
SMALL OUTLINE |
SOP28,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
17.9 mm |
|||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
20 mA |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
e0 |
36.205 mm |
|||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.012 mA |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
25 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||
Onsemi |
MODEM-DEMODULATOR |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER |
1.27 mm |
QUAD |
1 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
||||||||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
11.4808 mm |
|||||||||||||||
Onsemi |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
5 V |
IN-LINE |
70 Cel |
0 Cel |
DUAL |
.0003 Mbps |
R-PDIP-T28 |
Not Qualified |
|||||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN/NICKEL PALLADIUM GOLD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e3/e4 |
40 |
260 |
11.4808 mm |
||||||||||
|
Onsemi |
MODEM |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28(UNSPEC) |
Modems |
70 Cel |
-25 Cel |
QUAD |
.00144 Mbps |
S-PQCC-J28 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
11.4808 mm |
|||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e0 |
11.4808 mm |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e0 |
11.4808 mm |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
.6 mA |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
.6 mA |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
e0 |
36.83 mm |
||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
-5 V |
125 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
e0 |
||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
PROGRAMMABLE MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0192 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
DATA RATE MIN:1.2KBPS |
e0 |
36.83 mm |
|||||||||||||
STMicroelectronics |
MODEM |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
85 Cel |
-25 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
e0 |
36.83 mm |
||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0192 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
DATA RATE MIN:1.2KBPS |
e0 |
11.5062 mm |
||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
BIPOLAR |
-5 V |
125 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-CDIP-T28 |
5.72 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
e0 |
37.215 mm |
|||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
36.83 mm |
||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-5 V |
150 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
e0 |
|||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
||||||||||||||||
|
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
10 V |
5,10 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
.0024 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e3 |
11.5062 mm |
||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-5 V |
125 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.