STMicroelectronics - TSG7515P

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TSG7515P by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number TSG7515P
Description MODEM; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TSG7515P Datasheet
In Stock3,597
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Telecom IC Type: MODEM
Sub-Category: Modems
Surface Mount: NO
Maximum Supply Current: 30 mA
Minimum Operating Temperature: 0 Cel
No. of Terminals: 28
Qualification: Not Qualified
Package Equivalence Code: DIP28,.6
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T28
Package Shape: RECTANGULAR
Nominal Negative Supply Voltage: -5 V
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): +-5
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