48 Modems 32

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MPL360BT-I/Y8X	Microchip Technology	PROGRAMMABLE MODEM	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ		.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.2 mm	7 mm						7 mm
MPL360B-I/SCB	Microchip Technology	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.25SQ,16		.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	6 mm						6 mm
MPL360B-I/Y8X	Microchip Technology	PROGRAMMABLE MODEM	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ		.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.2 mm	7 mm						7 mm
MAX79356ECM+	Analog Devices	MODEM	INDUSTRIAL	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.2304 Mbps	S-PQFP-G48	1	1.6 mm	7 mm			e3	30	260	7 mm
MPL360BT-I/SCB	Microchip Technology	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.25SQ,16		.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	6 mm						6 mm
TRF3520	Texas Instruments	MODEM-MODULATOR		GULL WING	48		SQUARE	PLASTIC/EPOXY	YES							FLATPACK							QUAD		S-PQFP-G48				Not Qualified
TRF3520PT	Texas Instruments	MODEM-MODULATOR	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7 mm
TRF3520PFB	Texas Instruments	MODEM-MODULATOR	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.2 mm	7 mm	Not Qualified					7 mm
AD9975ABST	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.227 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
AD9975ABSTZ	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
AD9975ABSTRL	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.227 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
AD9975ABSTZRL	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
TS75240CP/XX	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	480 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	.0024 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
STLC7550TQF7TR	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
ST7554TQF7	STMicroelectronics	MODEM-DATA/FAX/VOICE	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
STLC7550TQF7	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
TS75C322CP	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V		5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified		e0
TS75C321CP	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V		5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified		e0
TS75C320CP	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V	5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified	DATA RATE MIN:300BPS	e0
ST75951	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
TS75C960CP-S	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V	5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified	DATA RATE MIN:300BPS	e0
TS75C962CP-S	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified	DATA RATE MIN:300BPS	e0
TS75C250CP	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	30 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	.0024 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
TS75C961CP-S	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified	DATA RATE MIN:300BPS	e0
TS75322CP	STMicroelectronics	MODEM-DEMODULATOR	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	35 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	.0096 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
TS75321CP	STMicroelectronics	MODEM-MODULATOR	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	35 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	.0096 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
E-STLC7550TQF7	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel		QUAD	.056 Mbps	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e3/e4			7 mm
UCB1100LP/X3	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
UCB1300BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1200BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1300BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1200BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.