HVQCCN Modems 33

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD5700-1ACPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
DS8500-JND+	Analog Devices	MODEM	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.000285 mA		3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	Modems	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.0012 Mbps	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
AD5700-1BCPZ-R5	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	4 mm			e3	30	260	4 mm
AD5700-1BCPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
AD5700BCPZ-R5	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	4 mm			e3		260	4 mm
AD5700ACPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
AD5700BCPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
DAC8741HRGET	Texas Instruments	PROGRAMMABLE MODEM	MILITARY	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.03125 Mbps	S-PQCC-N24	2	1 mm	4 mm		DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF	e4	30	260	4 mm
A5191HRTNG-XTP	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.0012 Mbps	S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
DAC8741HRGER	Texas Instruments	PROGRAMMABLE MODEM	MILITARY	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.03125 Mbps	S-PQCC-N24	2	1 mm	4 mm			e4	30	260	4 mm
DAC8740HRGET	Texas Instruments	PROGRAMMABLE MODEM	MILITARY	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.15SQ,20		.5 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.03125 Mbps	S-PQCC-N24	2	1 mm	4 mm		DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF	e4	NOT SPECIFIED	260	4 mm
MPL360B-I/SCB	Microchip Technology	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.25SQ,16		.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	6 mm						6 mm
NCN5192MNRG	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
CX20548-11Z	Conexant Systems	MODEM	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Modems	.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	.002 Mbps	S-XQCC-N16	1	.9 mm	4 mm	Not Qualified		e3	30	260	4 mm
DAC8740HRGER	Texas Instruments	PROGRAMMABLE MODEM	MILITARY	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.15SQ,20		.5 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.03125 Mbps	S-PQCC-N24	2	1 mm	4 mm		DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF	e4	NOT SPECIFIED	260	4 mm
MPL360BT-I/SCB	Microchip Technology	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.25SQ,16		.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	6 mm						6 mm
SN65HVD64RGTR	Texas Instruments	MODEM	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		33 mA			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				120 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	2					e4	30	260
LTC5585IUF#TRPBF	Analog Devices	MODEM-DEMODULATOR	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
LTC5585IUF#PBF	Analog Devices	MODEM-DEMODULATOR	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
NCN49599MNG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		60 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm	Not Qualified					8 mm
NCN49599MNRG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		60 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
A5191HRTNG-XTD	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-XQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
NCN5192MNG	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
TDA8263HN/C1,518	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4			5 mm
TDA8262HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
TDA8262HN/C1,118	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4			5 mm
TDA8263HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
935288611518	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
935288611557	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
935288611551	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
MAX2395ETI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX2395EGI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.9 mm	5 mm	Not Qualified		e0			5 mm
MAX2395ETI+	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.