MODEM Modems 247

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Fax Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
73K221SL-IP	Texas Instruments	MODEM	INDUSTRIAL	THROUGH-HOLE	22	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL	.0012 Mbps	R-PDIP-T22		5.08 mm	10.16 mm	Not Qualified	FULL DUPLEX				27.686 mm
73K302L-IP	Texas Instruments	MODEM	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL	.0012 Mbps	R-PDIP-T28		5.588 mm	15.24 mm	Not Qualified	FULL DUPLEX				35.941 mm
TCM3105DWL	Texas Instruments	MODEM	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12 mA	5 V	5	SMALL OUTLINE	SOP24,.4	Modems	1.27 mm	70 Cel		0 Cel		DUAL		R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified	FULL DUPLEX		NOT SPECIFIED	NOT SPECIFIED	15.4 mm
73K212SL-IC	Texas Instruments	MODEM	INDUSTRIAL	THROUGH-HOLE	22	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1				5 V		IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL	.0012 Mbps	R-GDIP-T22		5.08 mm	10.16 mm	Not Qualified	FULL DUPLEX				27.559 mm
73K222L-IH	Texas Instruments	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified	FULL DUPLEX				11.5062 mm
ADSP-21MOD970-510	Analog Devices	MODEM		BALL	304	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	GRID ARRAY	BGA304,23X23,50	Modems	1.27 mm		8 kbps		TIN LEAD	BOTTOM	.056 Mbps	S-PBGA-B304		2.54 mm	31 mm	Not Qualified		e0			31 mm
ADSP-21MOD970-000	Analog Devices	MODEM	COMMERCIAL	BALL	304	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	GRID ARRAY	BGA304(UNSPEC)	Modems	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM	.056 Mbps	S-PBGA-B304		2.54 mm	31 mm	Not Qualified		e0			31 mm
ADSP-21MOD970-110	Analog Devices	MODEM		BALL	304	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	GRID ARRAY	BGA304,23X23,50	Modems	1.27 mm		8 kbps		TIN LEAD	BOTTOM	.056 Mbps	S-PBGA-B304		2.54 mm	31 mm	Not Qualified		e0			31 mm
ADSP-21MOD870-110	Analog Devices	MODEM		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm		8 kbps		TIN LEAD	QUAD	.056 Mbps	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
AD9867BCPZ	Analog Devices	MODEM	INDUSTRIAL		64	QCCN	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER				85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD			3					e3		260
ADSP-21MOD870-100	Analog Devices	MODEM		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm		8 kbps		TIN LEAD	QUAD	.056 Mbps	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
AD9867BCPZRL	Analog Devices	MODEM	INDUSTRIAL		64	QCCN	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER				85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD			3					e3		260
ADSP-21MOD870-000	Analog Devices	MODEM	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
73M2901C/5V-32IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES				62 mA	5 V	5	CHIP CARRIER	LDCC32,.5X.6	Modems	1.27 mm	85 Cel		-40 Cel		QUAD		R-PQCC-J32				Not Qualified
73K222AL-IP	Analog Devices	MODEM	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		.012 mA	5 V	5	IN-LINE	DIP28,.6	Modems	2.54 mm	85 Cel		-40 Cel		DUAL	.0012 Mbps	R-PDIP-T28		5.588 mm	15.24 mm	Not Qualified	FULL DUPLEX				35.941 mm
73M2901-32IH/5	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.55 mm	11.43 mm	Not Qualified					13.97 mm
DS2245	Analog Devices	MODEM	COMMERCIAL		30			PLASTIC/EPOXY	NO		CMOS			5 V	5		SIP30,.2	Modems	2.54 mm	70 Cel		0 Cel	TIN LEAD	SINGLE						Not Qualified		e0
73K224L-IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		25 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel		-40 Cel		QUAD		S-PQCC-J28				Not Qualified
73M2901CL-IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.56 mm	11.455 mm	Not Qualified					13.995 mm
73K222AU-IP	Analog Devices	MODEM	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL	.0012 Mbps	R-PDIP-T40		5.588 mm	15.24 mm	Not Qualified	DATA RATE MIN:300BPS				51.943 mm
73K222AU-IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQCC-J44		5.08 mm	16.5862 mm	Not Qualified	DATA RATE MIN:300BPS				16.5862 mm
73M2901CL-IGV	Analog Devices	MODEM	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQFP-G32		1.2 mm	7 mm	Not Qualified					7 mm
73K324BL-IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.55 mm	11.43 mm	Not Qualified	DATA RATE MIN:300BPS				13.97 mm
73M2901-IGT/5	Analog Devices	MODEM	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified					10 mm
73K222BL-IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12 mA	5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	R-PQCC-J32		3.55 mm	11.43 mm	Not Qualified	FULL DUPLEX				13.97 mm
DS2245ML-24	Analog Devices	MODEM	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				70 Cel		0 Cel	TIN LEAD	SINGLE	.0024 Mbps	R-XSMA-N30				Not Qualified	FULL DUPLEX	e0
73M2901CE-IM	Analog Devices	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N32				Not Qualified
73M2901CL-IGT	Analog Devices	MODEM	INDUSTRIAL	GULL WING	40	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQFP-G40		1.6 mm	10 mm	Not Qualified					10 mm
73M2901CE-IGV	Analog Devices	MODEM	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES				15.5 mA		3/3.3	FLATPACK	TQFP32,.35SQ,32	Modems	.8 mm	85 Cel		-40 Cel		QUAD		S-PQFP-G32				Not Qualified
73M2901C/5V-IGT	Analog Devices	MODEM	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES				62 mA	5 V	5	FLATPACK	QFP44,.47SQ,32	Modems	.8 mm	85 Cel		-40 Cel		QUAD		S-PQFP-G44				Not Qualified
73K224BL-IH	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.56 mm	11.455 mm	Not Qualified	DATA RATE MIN:300BPS				13.995 mm
DS6122	Analog Devices	MODEM		THROUGH-HOLE	42	DIP	RECTANGULAR		NO					5 V	5	IN-LINE	DIP42(UNSPEC)	Modems					TIN LEAD	DUAL		R-XDIP-T42				Not Qualified		e0
73K222BL-IHR	Analog Devices	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	R-PQCC-J32		3.56 mm	11.455 mm	Not Qualified	FULL DUPLEX				13.995 mm
MAX2990ECB+	Analog Devices	MODEM																					MATTE TIN				3					e3	30	260
MAX2982GCD/V+W	Analog Devices	MODEM
MAX2990ECB+T	Analog Devices	MODEM																					MATTE TIN				3					e3	30	260
73M2901CE-IGVR/F	Analog Devices	MODEM	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES				15.5 mA		3/3.3	FLATPACK	TQFP32,.35SQ,32	Modems	.8 mm	85 Cel		-40 Cel		QUAD		S-PQFP-G32				Not Qualified
12197-507-XTP	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e3/e4	40	260	7 mm
12197-504	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified					11.4808 mm
12197-503	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
MC68194FJR2	Onsemi	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		.27 mA	5 V	5	CHIP CARRIER	LDCC52,.8SQ	Modems	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	10 Mbps	S-CQCC-J52		5.08 mm	18.935 mm	Not Qualified		e0			18.935 mm
AMIS30585C5852G	Onsemi	MODEM																															NOT SPECIFIED	NOT SPECIFIED
S3531-P	Onsemi	MODEM	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V		5 V		IN-LINE				70 Cel		0 Cel		DUAL	.0003 Mbps	R-PDIP-T28				Not Qualified
12197-508-XTP	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel	MATTE TIN/NICKEL PALLADIUM GOLD	QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified		e3/e4	40	260	11.4808 mm
AMIS30585AGA	Onsemi	MODEM	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28(UNSPEC)	Modems		70 Cel		-25 Cel		QUAD	.00144 Mbps	S-PQCC-J28				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
12197-507-XTD	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
MC68194FJ	Onsemi	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		.27 mA	5 V	5	CHIP CARRIER	LDCC52,.8SQ	Modems	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	10 Mbps	S-CQCC-J52		5.08 mm	18.935 mm	Not Qualified		e0			18.935 mm
12197-508-XTD	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified					11.4808 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.