MODEM Modems 247

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD5700-1ACPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
TDA5051AT/C1,518	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16	3			Not Qualified				260
A5191HRTLG-XTD	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Modems	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.0012 Mbps	S-PQFP-G32	3	1.6 mm	7 mm	Not Qualified		e3	30	260	7 mm
DS8500-JND+TR	Analog Devices	MODEM	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES			.000285 mA		3/3.3	CHIP CARRIER	LCC20,.20SQ,25	Modems	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N20	1			Not Qualified		e3
DS8500-JND+	Analog Devices	MODEM	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.000285 mA		3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	Modems	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.0012 Mbps	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
AD5700-1BCPZ-R5	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	4 mm			e3	30	260	4 mm
AD5700-1BCPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
A5191HRTLG-XTP	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Modems	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.0012 Mbps	S-PQFP-G32	3	1.6 mm	7 mm	Not Qualified		e3	30	260	7 mm
AD5700BCPZ-R5	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	4 mm			e3		260	4 mm
AD5700ACPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
AD5700BCPZ-RL7	Analog Devices	MODEM		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.8 mm	4 mm				30	260	4 mm
ST7540TR	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BCDMOS		5 V	5,9	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Modems	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	.0048 Mbps	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
ST7540	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BCDMOS		5 V	5,9	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Modems	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	.0048 Mbps	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
XB3-C-A2-UT-001	Digi International	MODEM	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.375 Mbps	R-XXMA-T20					POWER REQUIREMENTS AVAILABLE AT 3.3VDC INPUT POWER		NOT SPECIFIED	NOT SPECIFIED
TDA5051AT/C1,512	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16	3			Not Qualified				260
A5191HRTPG-XTD	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.0012 Mbps	S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified		e3	30	260	11.506 mm
A5191HRTPG-XTP	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.0012 Mbps	S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified		e3	30	260	11.506 mm
TDA5051AT/C1,118	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			68 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16				Not Qualified
FX604D4	Cml Microcircuits	MODEM	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0025 mA	5 V	3/5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	.0012 Mbps	R-PDSO-G16		2.67 mm	7.49 mm	Not Qualified	HALF DUPLEX	e3	40	260	10.26 mm
ST7538Q	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BCDMOS		5 V	5,9	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.0048 Mbps	S-PQFP-G44	3	1.6 mm	10 mm	Not Qualified		e4	30	260	10 mm
TDA5051AT/C1,112	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			68 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16				Not Qualified
TDA5051AT	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	DATA RATE MIN:600BPS	e4			10.3 mm
MAX79356ECM+T	Analog Devices	MODEM																			Matte Tin (Sn) - annealed				1					e3	30	260
A5191HRTNG-XTP	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.0012 Mbps	S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
TDA5051	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	DATA RATE MIN:600BPS				10.3 mm
TDA5051T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified					10.3 mm
TCM3105JE	Texas Instruments	MODEM	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS	16 mA	5 V	5	IN-LINE	DIP16,.3	Modems	2.54 mm	85 Cel	-40 Cel		DUAL		R-GDIP-T16		5.08 mm	7.62 mm	Not Qualified	FULL DUPLEX		NOT SPECIFIED	NOT SPECIFIED	19.56 mm
NCN5192MNRG	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0006 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
73M2901CE-IGV/F	Analog Devices	MODEM	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES			15.5 mA		3/3.3	FLATPACK	TQFP32,.35SQ,32	Modems	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
R9A06G037GNP#AA0	Renesas Electronics	MODEM																							3
ST7538QTR	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BCDMOS		5 V	5,9	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.0048 Mbps	S-PQFP-G44	3	1.6 mm	10 mm	Not Qualified		e4	30	260	10 mm
NCN5193MNTWG	Onsemi	MODEM
MAX79356ECM+	Analog Devices	MODEM	INDUSTRIAL	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.2304 Mbps	S-PQFP-G48	1	1.6 mm	7 mm			e3	30	260	7 mm
MPL460A-I/4LB	Microchip Technology	MODEM
MPL460AT-I/4LB	Microchip Technology	MODEM
MSM7510GS-K	Lapis Semiconductor	MODEM	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			10 mA		3/5	SMALL OUTLINE	SOP24,.45	Modems	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G24				Not Qualified		e0
FX614D4	Cml Microcircuits	MODEM	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0025 mA	5 V	3.3/5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	85 Cel	-40 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.67 mm	7.49 mm	Not Qualified					10.26 mm
CX20548-11Z	Conexant Systems	MODEM	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Modems	.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	.002 Mbps	S-XQCC-N16	1	.9 mm	4 mm	Not Qualified		e3	30	260	4 mm
80RWM6050BALGI	Renesas Electronics	MODEM																			TIN SILVER COPPER				4					e1		245
TCM3105NE	Texas Instruments	MODEM	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	16 mA	5 V	5	IN-LINE	DIP16,.3	Modems	2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified	FULL DUPLEX		NOT SPECIFIED	NOT SPECIFIED	19.304 mm
TCM3105NL	Texas Instruments	MODEM	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	12 mA	5 V	5	IN-LINE	DIP16,.3	Modems	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified	FULL DUPLEX		NOT SPECIFIED	NOT SPECIFIED	19.304 mm
CMX909BD5	Cml Microcircuits	MODEM	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Modems	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	.0384 Mbps	R-PDSO-G24		2 mm	5.3 mm	Not Qualified		e3	40	260	8.2 mm
A5191HRTPG	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN/NICKEL PALLADIUM GOLD	QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified		e3/e4	40	260	11.4808 mm
NL-SW-LTE-QBG96	Nimbus Technology	MODEM	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL	.375 Mbps	R-XDMA-T20		6.858 mm	28.95 mm		TRANSMITTING DATE RATE IS 300KBITPS				33.88 mm
SI3015-F-FS	Silicon Labs	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.018 mA	3.3 V	3.3/5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		DUAL	.0024 Mbps	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	ALSO OPERATES AT 5V SUPPLY		NOT SPECIFIED	NOT SPECIFIED	9.9 mm
SI2400-FS	Silicon Labs	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		32 mA	3.3 V	3.3/5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	.0024 Mbps	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	ALSO OPERATES AT 5V SUPPLY	e3			9.9 mm
MC145443DW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified					12.8 mm
MM74HC943WM	National Semiconductor	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	10 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	.0003 Mbps	R-PDSO-G20		2.6 mm	7.5 mm	Not Qualified	FULL DUPLEX	e0			12.8 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.