Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
260 |
|||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
260 |
|||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
68 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
68 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
DATA RATE MIN:600BPS |
e4 |
10.3 mm |
|||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
DATA RATE MIN:600BPS |
10.3 mm |
|||||||||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
|||||||||||
|
Conexant Systems |
MODEM |
COMMERCIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Modems |
.65 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
.002 Mbps |
S-XQCC-N16 |
1 |
.9 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
12 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.304 mm |
|||||||||
|
IXYS Corporation |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
PIN/PEG |
9 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
5 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
0 Cel |
DUAL |
R-XDMA-P9 |
Not Qualified |
NOT SPECIFIED |
260 |
|||||||||||||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.018 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.0024 Mbps |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
32 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.0024 Mbps |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e3 |
9.9 mm |
||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.056 Mbps |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
7.8 mm |
|||||||||||||
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
DUAL |
.0336 Mbps |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7.8 mm |
||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
DIP |
PLASTIC/EPOXY |
NO |
CMOS |
IN-LINE |
DIP(UNSPEC) |
Modems |
70 Cel |
0 Cel |
DUAL |
Not Qualified |
||||||||||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
12 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
|||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
15.4 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
-10 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
DIP |
PLASTIC/EPOXY |
NO |
CMOS |
IN-LINE |
DIP(UNSPEC) |
Modems |
70 Cel |
0 Cel |
DUAL |
Not Qualified |
||||||||||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
12 mA |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
15.4 mm |
|||||||||
Analog Devices |
MODEM |
COMMERCIAL |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY |
BGA304(UNSPEC) |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
.056 Mbps |
S-PBGA-B304 |
2.54 mm |
31 mm |
Not Qualified |
e0 |
31 mm |
||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
SMALL OUTLINE |
SOP28,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
17.9 mm |
|||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.585 mm |
Not Qualified |
e0 |
16.585 mm |
|||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
20 mA |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
e0 |
36.205 mm |
|||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
TQFP44,.47SQ,32 |
Modems |
1 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||||
Analog Devices |
MODEM |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
||||||||||
Analog Devices |
MODEM |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
SIP30,.2 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
e0 |
||||||||||||||||||||
Analog Devices |
MODEM |
COMMERCIAL |
NO LEAD |
30 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
5 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
0 Cel |
TIN LEAD |
SINGLE |
.0024 Mbps |
R-XSMA-N30 |
Not Qualified |
FULL DUPLEX |
e0 |
|||||||||||||||||
Onsemi |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
.27 mA |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
10 Mbps |
S-CQCC-J52 |
5.08 mm |
18.935 mm |
Not Qualified |
e0 |
18.935 mm |
|||||||||
Onsemi |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
5 V |
IN-LINE |
70 Cel |
0 Cel |
DUAL |
.0003 Mbps |
R-PDIP-T28 |
Not Qualified |
|||||||||||||||||||
Onsemi |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
.27 mA |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
10 Mbps |
S-CQCC-J52 |
5.08 mm |
18.935 mm |
Not Qualified |
e0 |
18.935 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
19.1262 mm |
|||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
480 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
.0024 Mbps |
R-PDIP-T48 |
5.08 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
e0 |
36.83 mm |
||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP80,.63SQ,32 |
Modems |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
FAX RATE MIN:2.4KBPS |
e0 |
14 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
20 mA |
5 V |
+-5 |
IN-LINE |
DIP22,.4 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
e0 |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
e0 |
19.1262 mm |
|||||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
|||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.1 mA |
5 V |
5 |
FLATPACK |
QFP64,.66SQ,32 |
Modems |
.8 mm |
70 Cel |
14.4 kbps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3.4 mm |
14 mm |
Not Qualified |
FAX RATE MIN:2.4KBPS |
e4 |
14 mm |
|||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
Other Telecom ICs |
.8 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
1.7 mm |
8 mm |
Not Qualified |
e1 |
8 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.