INDUSTRIAL Modems 153

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NCN49597MNG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	52	QCCN	SQUARE	PLASTIC/EPOXY	YES					.06 mA	3.3 V	3.3	CHIP CARRIER	LCC52,.31SQ,20	Modems	.5 mm	115 Cel	-40 Cel		QUAD		S-PQCC-N52				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
NCN49597C5972MNRG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	52	QCCN	SQUARE	PLASTIC/EPOXY	YES						3.3 V	3.3	CHIP CARRIER	LCC52,.31SQ,20	Modems	.5 mm	115 Cel	-40 Cel		QUAD		S-PQCC-N52				Not Qualified
12197-507-XTP	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e3/e4	40	260	7 mm
12197-504	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified					11.4808 mm
12197-503	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
NCN49599MNG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				60 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm	Not Qualified					8 mm
NCN49599MNRG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				60 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
12197-508-XTP	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN/NICKEL PALLADIUM GOLD	QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified		e3/e4	40	260	11.4808 mm
12197-507-XTD	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
NCN49597MNRG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	52	QCCN	SQUARE	PLASTIC/EPOXY	YES					.06 mA	3.3 V	3.3	CHIP CARRIER	LCC52,.31SQ,20	Modems	.5 mm	115 Cel	-40 Cel		QUAD		S-PQCC-N52				Not Qualified
NCN49599MNTWG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES					.06 mA	3.3 V	3.3	CHIP CARRIER	LCC56,.31SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56				Not Qualified
12197-508-XTD	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified					11.4808 mm
12197-503-XTP	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
NCN49597C5972MNG	Onsemi	PROGRAMMABLE MODEM	INDUSTRIAL	NO LEAD	52	QCCN	SQUARE	PLASTIC/EPOXY	YES						3.3 V	3.3	CHIP CARRIER	LCC52,.31SQ,20	Modems	.5 mm	115 Cel	-40 Cel		QUAD		S-PQCC-N52				Not Qualified
12197-504-XTP	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified		e0			11.4808 mm
A5191HRTL-XTP	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES					.6 mA		3.3/5	FLATPACK	QFP32,.35SQ,32	Modems	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
A5191HRTNG-XTD	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-XQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
A5191HRTP	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.4808 mm	Not Qualified		e0			11.4808 mm
A5191HRTL	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	.0012 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
A5191HRTP-XTD	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES					.6 mA		3.3/5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel	-40 Cel		QUAD		S-PQCC-J28				Not Qualified
A5191HRTLG	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN	QUAD	.0012 Mbps	S-PQFP-G32	3	1.6 mm	7 mm	Not Qualified		e3			7 mm
A5191HRTP-XTP	Onsemi	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES					.6 mA		3.3/5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel	-40 Cel		QUAD		S-PQCC-J28				Not Qualified
NCN5192MNG	Onsemi	MODEM	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
A5191HRTL-XTD	Onsemi	MODEM	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES					.6 mA		3.3/5	FLATPACK	QFP32,.35SQ,32	Modems	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
STLC60134	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	8 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY	e0			10 mm
TS7513IP	STMicroelectronics	MODEM	INDUSTRIAL	THROUGH-HOLE	22	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			-5 V	20 mA	5 V	+-5	IN-LINE	DIP22,.4	Modems	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	.0012 Mbps	R-PDIP-T22		5.08 mm	10.16 mm	Not Qualified	FULL DUPLEX	e0
STLC60135	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G144		4.07 mm	28 mm	Not Qualified		e4			28 mm
STLC1510	STMicroelectronics	MODEM	INDUSTRIAL	BALL	132	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA132,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.5 Mbps	S-PBGA-B132	1	1.7 mm	12 mm	Not Qualified		e3			12 mm
STLC60134TR	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	8 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY				10 mm
ST7538P	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BCDMOS				5 V	5,9	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.0048 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified	HALF DUPLEX	e4			10 mm
MC145442BDW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			10 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e0			12.8 mm
MC145443BDW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.01 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e0			12.8 mm
MC145443BP	NXP Semiconductors	MODEM	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS				5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	.0003 Mbps	R-PDIP-T20		4.57 mm	7.62 mm	Not Qualified					26.415 mm
MC145442BP	NXP Semiconductors	MODEM	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			10 mA	5 V	5	IN-LINE	DIP20,.3	Modems	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDIP-T20		4.57 mm	7.62 mm	Not Qualified		e0			26.415 mm
PEF22827ELV1.1	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES							1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B225	3			Not Qualified				235
PEF22827ELV1.1-G	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES							1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B225				Not Qualified
VDSL6100I	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES							1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B225				Not Qualified
MAX2395ETI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e0			5 mm
73K324L-28IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28		4.572 mm	11.54 mm	Not Qualified					11.54 mm
MAX2982GCD/V+T	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	AEC-Q100				1.2,3.3	FLATPACK	QFP128,.63X.87,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3			Not Qualified		e3	30	260
MAX2395EGI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.9 mm	5 mm	Not Qualified		e0			5 mm
73M2901CE-IM/F	Maxim Integrated	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	3			Not Qualified			30	260
73K224L-IP	Maxim Integrated	MODEM	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			25 mA	5 V	5	IN-LINE	DIP28,.6	Modems	2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T28				Not Qualified
73K222AL-IH	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.012 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel	-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.5062 mm	Not Qualified	FULL DUPLEX				11.5062 mm
MAX2982GCD+	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Modems	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	14 Mbps	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm
MAX2395ETI+	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
73M2901CE-IMR/F	Maxim Integrated	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	3			Not Qualified			30	260
73K324BL-IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32		3.56 mm	11.455 mm	Not Qualified					14 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.