Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.51 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e1 |
20 |
260 |
11 mm |
||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.5 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e1 |
20 |
260 |
11 mm |
||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
367 mA |
3.3 V |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA100,10X10,32 |
Network Interfaces |
.8 mm |
70 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B100 |
1.1 mm |
9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
2 |
3.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
100 Mbps |
S-PBGA-B100 |
1 |
1.38 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
|||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
2 |
3.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
100 Mbps |
S-PBGA-B100 |
1.38 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
QFP100,.75X.99 |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.3 mm |
14 mm |
20 mm |
|||||||||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
QFP100,.75X.99 |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.3 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
1000 Mbps |
R-PBGA-B100 |
3 |
260 |
|||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
GRID ARRAY |
BOTTOM |
1000 Mbps |
R-PBGA-B100 |
3 |
260 |
||||||||||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 V |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
|||||||||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 V |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
|||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
|||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2.5,2.5/3.3 |
FLATPACK |
QFP100,.7X.9 |
Network Interfaces |
.635 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
BOTTOM |
1000 Mbps |
S-PBGA-B100 |
||||||||||||||||||||||||||
Cypress Semiconductor |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e0 |
11 mm |
||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
1000 Mbps |
R-PBGA-B100 |
3 |
260 |
|||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
FLATPACK |
QUAD |
S-PQFP-G100 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.5 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e1 |
20 |
260 |
11 mm |
||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Network Interfaces |
.5 mm |
QUAD |
100 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
QUAD |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
14 mm |
|||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
QUAD |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
14 mm |
|||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Network Interfaces |
.5 mm |
QUAD |
100 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
5 V |
FLATPACK |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
20 mm |
||||||||||||||||||||
|
Maxim Integrated |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||||
|
Maxim Integrated |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
10 mm |
Not Qualified |
e1 |
30 |
260 |
10 mm |
|||||||||||||||
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
10 mm |
Not Qualified |
e1 |
225 |
10 mm |
|||||||||||||||||
|
Renesas Electronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
e3 |
30 |
260 |
14 mm |
||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
20 mm |
|||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
FLATPACK |
QFP100,.7X1.0 |
Network Interfaces |
.635 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
Not Qualified |
e0 |
|||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
.4 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.7X.9 |
Network Interfaces |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
FLATPACK |
QFP100,.7X1.0 |
Network Interfaces |
.635 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
Not Qualified |
e0 |
|||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
FLATPACK |
QFP100,.7X1.0 |
Network Interfaces |
.635 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
Not Qualified |
e0 |
|||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
||||||||||||||||||
Broadcom |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
FLATPACK |
QFP100,.7X1.0 |
Network Interfaces |
.635 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
Not Qualified |
e0 |
|||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
BGA100(UNSPEC) |
BOTTOM |
R-PBGA-B100 |
|||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
20 mm |
|||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK |
QUAD |
X-PQFP-G100 |
1 |
Not Qualified |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
X-PBGA-B100 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
X-PBGA-B100 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
X-PBGA-B100 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
X-PBGA-B100 |
Not Qualified |
|||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
1 |
3.4 mm |
14 mm |
Not Qualified |
20 mm |
|||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B100 |
1 |
9 mm |
Not Qualified |
9 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
FLATPACK |
QUAD |
S-PQFP-G100 |
|||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B100 |
9 mm |
Not Qualified |
9 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.