256 Network Interfaces 80

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

DS33X82+

Analog Devices

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.77 mm

17 mm

Not Qualified

e1

30

260

17 mm

MC92603VM

NXP Semiconductors

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY

1 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.6 mm

17 mm

Not Qualified

e1

40

260

17 mm

CYV15G0401DXB-BGXC

Infineon Technologies

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

256

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

4

1.1 mA

3.3 V

3.3

GRID ARRAY, HEAT SINK/SLUG

BGA256,20X20,50

Network Interfaces

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1500 Mbps

S-PBGA-B256

3

1.745 mm

27 mm

Not Qualified

e1

20

260

27 mm

DS33X162+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.77 mm

17 mm

Not Qualified

e1

30

260

17 mm

DS33Z44+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.8 mm

17 mm

Not Qualified

e1

30

260

17 mm

DS33Z44

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

1.77 mm

17 mm

Not Qualified

e1

245

17 mm

BCM8705

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B256

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BCM8705LBIFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BGA256(UNSPEC)

BOTTOM

10518.8 Mbps

S-PBGA-B256

QQ84302/A

Broadcom

COMMERCIAL

GULL WING

256

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

300 mA

5 V

5

FLATPACK

QFP256,1.2SQ,16

Network Interfaces

.4 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G256

Not Qualified

e0

BCM8706BIFB

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BOTTOM

S-PBGA-B256

BCM8705LAIFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1

GRID ARRAY

BOTTOM

10518.8 Mbps

S-PBGA-B256

BCM82756AIFSBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1 V

GRID ARRAY

BOTTOM

10000 Mbps

S-PBGA-B256

BCM53128IQLE

Broadcom

ETHERNET TRANSCEIVER

GULL WING

256

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

8

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

.4 mm

85 Cel

-45 Cel

QUAD

1000 Mbps

S-PQFP-G256

1.6 mm

28 mm

TMII MODE SUPPORTS 200 MBPS DATA RATE

28 mm

BCM53128KQLE

Broadcom

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

256

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

8

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

.4 mm

70 Cel

0 Cel

QUAD

1000 Mbps

S-PQFP-G256

1.6 mm

28 mm

TMII MODE SUPPORTS 200 MBPS DATA RATE

28 mm

BCM5466SR

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B256

1

Not Qualified

BCM5396IFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B256

NOT SPECIFIED

NOT SPECIFIED

BCM5464SRA1KFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B256

BCM5466SRA0KFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B256

NOT SPECIFIED

NOT SPECIFIED

BCM5228B

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

Not Qualified

BCM5228BA4IPB

Broadcom

ETHERNET TRANSCEIVER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

8

892 mA

2.5,2.5/3.3

GRID ARRAY

BGA256,16X16,40

Network Interfaces

1 mm

70 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B256

Not Qualified

BCM5228BA4KPB

Broadcom

ETHERNET TRANSCEIVER

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

8

892 mA

2.5 V

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1 mm

70 Cel

0 Cel

BOTTOM

100 Mbps

S-PBGA-B256

1.55 mm

17 mm

17 mm

BCM53128VKQLEG

Broadcom

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

256

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

7

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

.4 mm

70 Cel

0 Cel

QUAD

100 Mbps

S-PQFP-G256

3

1.6 mm

28 mm

ALSO REQUIRE 3.3V SUPPLY

28 mm

BCM5400

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

X-PBGA-B256

1

Not Qualified

BCM5401

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

1

Not Qualified

BCM5464R

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B256

1

Not Qualified

BCM53118KQLEG

Broadcom

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

256

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

8

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

.4 mm

70 Cel

0 Cel

QUAD

1000 Mbps

S-PQFP-G256

3

1.6 mm

28 mm

28 mm

BCM5396

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B256

Not Qualified

BCM5466RA0KFB

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B256

BCM5248XA4KFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

8

1.8 V

BGA256(UNSPEC)

BOTTOM

R-PBGA-B256

3

Also has 2.5V Supply

260

BCM5464SR

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B256

1

Not Qualified

BCM5466R

Broadcom

ETHERNET TRANSCEIVER

BALL

256

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B256

1

Not Qualified

BCM5248UA4IQLEG

Broadcom

ETHERNET TRANSCEIVER

BALL

256

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.8 V

BGA256(UNSPEC)

BOTTOM

R-PBGA-B256

IT IS ALSO AVAILABLE IN 128 PIN QFP

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.