256 Network Interfaces 80

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC8662XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
VSC8504XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	900 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM53128KQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
VSC8552XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
CYP15G0401DXB-BGXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
VSC8552XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8575XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8564XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8572XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2		2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
DS33W11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33W41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X161+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1			17 mm
DS33X41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X42+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X81+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
VSC8572XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8504XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	900 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
VSC8504XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm						17 mm
VSC8574XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	980 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8572XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8486YSN-04	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	95 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	10518.75 Mbps	S-PBGA-B256		3.22 mm	17 mm			e1			17 mm
VSC8572XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8574XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	980 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8584XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8552XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM54140B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	4				GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B256						e1		255
VSC8504XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8575XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM54140B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	4				GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B256							NOT SPECIFIED	NOT SPECIFIED
BCM53134SKFBG	Broadcom	SUPPORT CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY							BOTTOM		S-PBGA-B256	3							260
VSC8552XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8584XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
BCM53128IQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-45 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
VSC8662XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm						17 mm
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm			e1			17 mm
CYP15G0403DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
CYP15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
CYW15G0403DXB-BGI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e0			27 mm
BCM8705LBIFB	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1				GRID ARRAY	BGA256(UNSPEC)						BOTTOM	10518.8 Mbps	S-PBGA-B256
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e0			27 mm
VSC8664XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
VSC8664XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
VSC8562XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	17 mm
VSC8562XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	17 mm
DS33X81+W	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256	3	1.82 mm	17 mm						17 mm
DS33W11DK+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.82 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	17 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.