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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC33FS6527KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6508NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6528CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6528NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6526NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6516CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6526NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6500NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6516CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4508NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6515KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33907AER2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
MC33FS4505KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6507LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33665ATU4AE	NXP Semiconductors	CAN FD TRANSCEIVER		GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				FLATPACK				125 Cel	-40 Cel		QUAD	10 Mbps	S-PQFP-G48
MC33665ATF4AE	NXP Semiconductors	CAN FD TRANSCEIVER		GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				FLATPACK				125 Cel	-40 Cel		QUAD	10 Mbps	S-PQFP-G48	3					40	260
ADM7001/X	Infineon Technologies	ETHERNET TRANSCEIVER		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			MATTE TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
ADM7001	Infineon Technologies	ETHERNET TRANSCEIVER		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1		2.5 V	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm				QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TLE9261-3BQX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9263-3BQX	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE92603QXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9263-3BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9261QXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9262BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9263BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9261BQX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9260-3QX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9271QXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	10 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel	Tin (Sn)	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE92603QXXUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9261-3QXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	.5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9261QX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9261BQXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9261-3BQXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE92613QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	.5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9262BQX	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9272QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9262-3BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9271QXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	10 mA	6.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9272QXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	10 mA	6.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9261BQXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9263BQXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
MAX2821ETM-TD	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			.11 mA	2.7 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0			7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.