8 Network Interfaces 1,352

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1020T/VM,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1021T/10/C,112	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4		260	4.9 mm
TJA1021TK/10/C/S90	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm					3 mm
TJA1029T	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					4.9 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE7250VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm		e3			3 mm
ATA6660	Atmel	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BCDMOS			1	.06 mA	5 V	5	SMALL OUTLINE, LOW PROFILE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8		1.65 mm	3.8 mm	Not Qualified	e0			4.925 mm
ATA6660-TAQ	Atmel		AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE, LOW PROFILE			1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.65 mm	3.8 mm		e0			4.925 mm
MAX13051ESA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX13051ESA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MCP2021-330E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3		260	4.9 mm
MCP2021-500E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3		260	4.9 mm
MCP2561T-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
NCV7342MW3R2G	Onsemi	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100		1	.075 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
PTCAN1044ADRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N8
PTCAN1044ADRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1		5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.71 mm	3.895 mm					4.905 mm
PTCAN3414DRBR	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1				1	60 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
TLE9251SJXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	48 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL	5 Mbps	R-PDSO-G8	2A	1.73 mm	3.94 mm					4.93 mm
TLIN10283DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	300 mA	6.1 V		SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TLIN10285DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	300 mA	6.1 V		SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MCP2021A-500E/SN	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
MCP2025T-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
MCP2025-330E/P	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949		1		12 V		IN-LINE	DIP8,.3		2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.334 mm	7.62 mm		e3			9.271 mm
NCV7340D13R2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8	2	1.7272 mm	3.937 mm	Not Qualified	e3	30	260	4.9276 mm
NCV7357MW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		1	105 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
MAX3059ASA-T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3059ASA+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
AU5790D	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.045 mA	13 V	12	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	.1 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm	Not Qualified		30	260	4.9 mm
BD41020FJ-CE2	ROHM	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							12 V		SMALL OUTLINE, LOW PROFILE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.65 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
BD41044FJ-CE2	ROHM	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, LOW PROFILE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.65 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
ATA6562-GBQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
ATA6564-GAQW0	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	85 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm					4.9 mm
ATA663255-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
HVDA540QDRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1		5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
HVDA541QDRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1		5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
MCP2003BT-H/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
MCP2003T-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		7 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2004-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2004T-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2021T-330E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e3			4.9 mm
MCP2025-500E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
TPS2371PWG4	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					48 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.2 mm	3 mm	Not Qualified	e4	30	260	4.4 mm
TPS2371DRG4	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					48 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
SN75LBC031P	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1							5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified				9.81 mm
HVDA5425QDRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1		5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
V62/07608-01XE	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1				1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
UC5661N	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				-9 V		.02 mA		-9	IN-LINE	DIP8,.3	Network Interfaces	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T8		5.33 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.78 mm
V62/06629-01XE	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS			1	.017 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.