LFBGA Network Interfaces 39

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SJA1105PELY	NXP Semiconductors	SUPPORT CIRCUIT		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B159	3	1.5 mm	12 mm				260	12 mm
KSZ8893MBLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	2		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100	1	1.38 mm	9 mm	Not Qualified	e1			9 mm
KSZ8893MBL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	2		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32		.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100		1.38 mm	9 mm	Not Qualified	e1			9 mm
AD9375BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			30	260	12 mm
FLLXT971ABE.A4-834104	Cortina Systems	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.11 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B64		1.36 mm	7 mm	Not Qualified		30	240	7 mm
AD9375BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			30	260	12 mm
DS33X11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.5 mm	10 mm	Not Qualified	e1	30	260	10 mm
AQR108-B0-EG-Y	Marvell Technology	ETHERNET TRANSCEIVER	OTHER	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	108 Cel	0 Cel		BOTTOM		R-PBGA-B104		1.57 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	11 mm
ELLXT971ABE.A4-870479	Cortina Systems	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.11 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B64		1.36 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
AQR107-B0-IG-Y	Marvell Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	108 Cel	-40 Cel		BOTTOM		R-PBGA-B104		1.57 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	11 mm
ELLXT971ABE.A4-870480	Cortina Systems	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.11 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B64		1.36 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
AQR108-B0-IG-Y	Marvell Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	108 Cel	-40 Cel		BOTTOM		R-PBGA-B104		1.57 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	11 mm
PX1011BI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
BCM53158XUB1KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	311	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B311	3	1.337 mm	13 mm		e1			13 mm
ELLXT971ABE.A4	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1.26 mm	7 mm	Not Qualified		40	260	7 mm
PX1011A-EL1:557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified				9 mm
PX1011BI-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011B-EL1/N	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1011B-EL1/Q900	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011B-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1041A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B208		1.5 mm	15 mm	Not Qualified	e1			15 mm
PX1011BI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified	e1	30	260	9 mm
PX1011B-EL1/N,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1012A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011A-EL1	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified				9 mm
PX1041AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B208		1.5 mm	15 mm	Not Qualified	e1			15 mm
PX1012A-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011B-EL1/N,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1012AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011B-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1011B-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
MAX2986CXV	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM		S-PBGA-B144		1.4 mm	12 mm		e0			12 mm
82P2916BF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	Digital Transmission Interfaces	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B484	3	1.7 mm	19 mm	Not Qualified	e0	20	225	19 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.