VFBGA Network Interfaces 16

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TUSB2E22YCGT

Texas Instruments

INTERFACE CIRCUIT

COMMERCIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

.35 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.5 mm

2 mm

30

260

2 mm

VSC8502XML-03

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

135

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

1 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

LCC135,.47SQ,25

.65 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

1000 Mbps

S-PBGA-B135

.85 mm

12 mm

e4

12 mm

TUSB2E22YCGR

Texas Instruments

INTERFACE CIRCUIT

COMMERCIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

.35 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.5 mm

2 mm

30

260

2 mm

NTS0104UK,012

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

1

.615 mm

1.2 mm

1.6 mm

TLK2201AJRZQE

Texas Instruments

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.111 mA

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Network Interfaces

.5 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1600 Mbps

S-PBGA-B80

3

1 mm

5 mm

Not Qualified

e1

30

260

5 mm

TLK2201AJRGQE

Texas Instruments

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.111 mA

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Network Interfaces

.5 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

1600 Mbps

S-PBGA-B80

2A

1 mm

5 mm

Not Qualified

e0

20

235

5 mm

TLK2201JRZQE

Texas Instruments

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.111 mA

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Network Interfaces

.5 mm

70 Cel

0 Cel

BOTTOM

1600 Mbps

S-PBGA-B80

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

TLK2201JRGQE

Texas Instruments

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.111 mA

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Network Interfaces

.5 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

1600 Mbps

S-PBGA-B80

2A

1 mm

5 mm

Not Qualified

e0

20

235

5 mm

MAX13345EEBC+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

935296091023

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.615 mm

1.2 mm

1.6 mm

935296091012

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.615 mm

1.2 mm

1.6 mm

NTS0104UK,023

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.615 mm

1.2 mm

1.6 mm

NTS0104UK

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.615 mm

1.2 mm

1.6 mm

MAX13342EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX13345EEBC+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX13342EEBC+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.