SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PX1011AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PN5331B3HN/C270,51	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	2	1 mm	6 mm	Not Qualified	e4		260	6 mm
PDI1394P11-T	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e3			10 mm
SAA7207H/C1GPB	NXP Semiconductors	REED-SOLOMON DECODER		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1						5 V		FLATPACK			.8 mm				QUAD	S-PQFP-G44		2.1 mm	10 mm	Not Qualified				10 mm
SAA7207H/C1GPB-T	NXP Semiconductors	REED-SOLOMON DECODER		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1						5 V		FLATPACK			.8 mm				QUAD	S-PQFP-G44		2.1 mm	10 mm	Not Qualified				10 mm
PDI1394P25BY	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		40	260	7 mm
PDI1394P25BY,151	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
PX1011B-EL1/N,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
SAA7207H/C1-T	NXP Semiconductors	REED-SOLOMON DECODER	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1						5 V		FLATPACK			.8 mm	70 Cel	0 Cel		QUAD	S-PQFP-G44		2.1 mm	10 mm	Not Qualified				10 mm
PN5331B3HN/C270	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm	Not Qualified				6 mm
PX1012AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
NE8392AA-T	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-9 V					CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified				11.5062 mm
PX1011A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011B-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1011B-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
935360434557	NXP Semiconductors	CAN FD TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm					7 mm
MC35FS4503NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
F104X8A,699	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	138	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N138		.85 mm	12 mm					12 mm
F104S8A	NXP Semiconductors	ETHERNET TRANSCEIVER	OTHER	NO LEAD	138	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	0 Cel		QUAD	S-PQCC-N138		.85 mm	12 mm					12 mm
935300642118	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL	S-PDSO-N8		1 mm	3 mm					3 mm
MC35FS4501CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC92603VM	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					1.8 V		GRID ARRAY			1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.6 mm	17 mm	Not Qualified	e1	40	260	17 mm
935294212118	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL	S-PDSO-N8		1 mm	3 mm					3 mm
MC34CM3120EPR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		1 mm	5 mm					5 mm
935293621132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1 mm					1 mm
MC35FS4503CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
935303442118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	4 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	S-PDSO-N8		1 mm	3 mm					3 mm
MC13201	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
MC68160AFB	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	52	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS					5 V		FLATPACK, LOW PROFILE			.65 mm	70 Cel	0 Cel		QUAD	S-PQFP-G52		1.7 mm	10 mm					10 mm
MC34CM3120EP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		1 mm	5 mm					5 mm
MCR20AVHM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	LGA	SQUARE	UNSPECIFIED	YES	1					.0195 mA	2.7 V	2.7	GRID ARRAY	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	NICKEL GOLD	BOTTOM	S-XBGA-N32	3			Not Qualified	e4	40	260
MC35FS4500CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
935293486132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel		DUAL	S-PDSO-N6		.35 mm	1 mm					1 mm
MC13202	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
F104X8A	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	138	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N138		.85 mm	12 mm					12 mm
MC35FS4500NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
935324989557	NXP Semiconductors	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1								FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm		e3	40	260	7 mm
MC13203	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
MC35FS4502CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4501NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
935299509118	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL	S-PDSO-N8		1 mm	3 mm					3 mm
MC35FS4502NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
935360432557	NXP Semiconductors	CAN FD TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm					7 mm
MC33FS6508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6518CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6517NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6527NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6506CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.