Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
CHIP CARRIER |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N36 |
|||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
1.55 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
e4 |
NOT SPECIFIED |
260 |
||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
2A |
4.57 mm |
11.43 mm |
Not Qualified |
e0 |
245 |
11.43 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
5 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
5 V |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||||||||||
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||||||||||
Analog Devices |
SUPPORT CIRCUIT |
COMMERCIAL |
NO LEAD |
8 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||||||||||
Analog Devices |
SUPPORT CIRCUIT |
COMMERCIAL |
NO LEAD |
8 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-XQCC-N40 |
1 mm |
6 mm |
6 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
40000 Mbps |
S-XQCC-N48 |
3 |
.8 mm |
7 mm |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
40000 Mbps |
S-XQCC-N48 |
3 |
.8 mm |
7 mm |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
BALL |
194 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA194,17X17,87 |
2.2 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B194 |
3.56 mm |
38 mm |
38 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
BALL |
194 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA194,17X17,87 |
2.2 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B194 |
3.56 mm |
38 mm |
NOT SPECIFIED |
NOT SPECIFIED |
38 mm |
||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
|||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.104 mA |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
1.82 mm |
17 mm |
17 mm |
||||||||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.82 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
|||||||||||||||||
|
Analog Devices |
REED-SOLOMON ENCODER/DECODER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.