SQUARE Network Interfaces 1,673

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
88E1111-B0-CAA-C000	Marvell Technology	ETHERNET TRANSCEIVER		BUTT	96	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS					1 V		CHIP CARRIER			.6 mm				BOTTOM		S-XBCC-B96		.8 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
88E1318-A0-NNB2C000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER						Tin (Sn)	QUAD		S-XQCC-N48					e3
88E3016-A2-NNC1C000	Marvell Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N64		1 mm	9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9 mm
AC101TF	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G80		1.2 mm	12 mm	Not Qualified				12 mm
ATA6624-PGQW	Atmel	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		1 mm	5 mm	Not Qualified				5 mm
BCM53134MKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm					11 mm
BCM8705LBIFB	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1				GRID ARRAY	BGA256(UNSPEC)						BOTTOM	10518.8 Mbps	S-PBGA-B256
CYP15G0201DXB-BBXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			2	.71 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e1		260	15 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
CYV15G0101DXB-BBXC	Infineon Technologies	INTERFACE CIRCUIT	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			1	.5 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified	e1	20	260	11 mm
ELLXT971ABE.A4	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1.26 mm	7 mm	Not Qualified		40	260	7 mm
SI4468-A2A-IMR	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e3	40	260	4 mm
SKY85330-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		NO LEAD	16		SQUARE	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY							QUAD		S-XQMA-N16						NOT SPECIFIED	NOT SPECIFIED
WBLXT9785HED0	Intel	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	208	HFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V		FLATPACK, HEAT SINK/SLUG, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
WG82567LMSLAVV	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES					1			1.05,1.8,3.3	CHIP CARRIER	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N56	1			Not Qualified	e3
WG82567V/SLAW7	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES					1			1.05,1.8,3.3	CHIP CARRIER	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N56	1			Not Qualified	e3
ATA6624C-PGQW-1	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1	53 mA			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.2SQ,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20		.9 mm	5 mm		e3			5 mm
KSZ8051MNLV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm		e3			5 mm
KSZ8051RNLUB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm		e4			5 mm
VSC8664XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm		e1			17 mm
VSC8664XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm		e1			17 mm
ATA6562-GBQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
ATA663255-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
CC3120RNMARGKR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
CC3120RNMARGKT	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
KS8001LI	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1		1.8 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
KS8721BL	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
KSZ8031RNLI-TR	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N24	2	.9 mm	4 mm		e4	40	260	4 mm
KSZ8041MLLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		1	58.3 mA	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQFP-G48		1.6 mm	7 mm		e3			7 mm
KSZ8051RNLV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm					5 mm
KSZ8692PB	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.33 mm	27 mm	Not Qualified	e1			27 mm
KSZ8841-32MVL	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3			14 mm
KSZ8841-32MVLI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G128		1.6 mm	14 mm	Not Qualified	e3			14 mm
LAN8810I-AKZE	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1		1.2 V	1.2,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N72		1 mm	10 mm	Not Qualified	e3			10 mm
MCP2003BT-H/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
TLE9263BQX	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLK1221RHAR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1	.113 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
VSC7444YIH-02	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					7500 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B672		2.71 mm	27 mm		e1	NOT SPECIFIED	NOT SPECIFIED	27 mm
VSC7464YIH-02	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					8400 mA	1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B672	4	2.71 mm	27 mm					27 mm
VSC8244XHG	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	260	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			4		1.2 V		GRID ARRAY, HEAT SINK/SLUG	BGA260,18X18,40		1 mm	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B260	4	2 mm	19 mm		e1	30	260	19 mm
VSC8562XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
VSC8562XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
TLK2201AIRCPG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	1600 Mbps	S-PQFP-G64		1 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TLK2218ZPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e1	30	260	19 mm
XA1243FPBGABL	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B161		1.17 mm	10.4 mm					10.4 mm
TNETE2201PJD	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1	330 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	1250 Mbps	S-PQFP-G64		1.2 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TLK2201BRCPG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
78Q8330-CH	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-9 V					CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J20		4.572 mm	8.94 mm	Not Qualified				8.94 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.