SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC4257CDD#TRPBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE		PLASTIC/EPOXY	YES	1								SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
RTL8201E-VB-GR	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1		CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
TLE7257LEXUMA1	Infineon Technologies	LIN TRANSCEIVER		NO LEAD	8	HTSON	SQUARE		PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100	1		7 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL	.02 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
VSC8541WZBRT-SV	Microchip Technology	ETHERNET TRANSCEIVER	MILITARY	FLAT	68	HGQFF	SQUARE	100k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	1			MIL-PRF-38535 Class V	1		1 V		FLATPACK, HEAT SINK/SLUG, GUARD RING	TPAK68,2.5SQ,25		.635 mm	125 Cel	-55 Cel		QUAD	1000 Mbps	S-CQFP-F68		3.91 mm	13.05 mm					13.05 mm
DP83TC811SWRNDTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		e4	30	260	6 mm
DS33Z11+UNUSED	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE		PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.5 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
HI-1575PQI	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER	INDUSTRIAL	GULL WING	32	TQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		2	500 mA	3.3 V		FLATPACK, THIN PROFILE	TQFP32,.35SQ,32		.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G32	3	1.2 mm	7 mm	Not Qualified	e0	30	240	7 mm
LAN8741A-EN-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N32		1 mm	5 mm		e3			5 mm
NCV7327MW0R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		UNSPECIFIED	YES	1			AEC-Q100	1	6.5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	S-XDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
PTCAN1057VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1								125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2				e4	30	260
SI4467-A2A-IM	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE		UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
TLK106RHBR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1				1		3.3 V	1.55,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	NOT SPECIFIED	260	5 mm
TLK111PT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1				4		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-PQFP-G48	1	1.6 mm	7 mm		e4	30	260	7 mm
VSC8486YJB-11	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	144	LBGA	SQUARE		PLASTIC/EPOXY	YES	1				1		1.2 V		GRID ARRAY, LOW PROFILE	BGA144,12X12,40		1 mm	85 Cel	-40 Cel		BOTTOM	.00001 Mbps	S-PBGA-B144		1.4 mm	13 mm					13 mm
WJLXT905LC.C2-863540	Cortina Systems	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	32	LQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1	.1 mA	5 V	3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Network Interfaces	.8 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	10 Mbps	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3	40	260	7 mm
WJLXT905LE.C2-863533	Cortina Systems	MANCHESTER ENCODER/DECODER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1	.1 mA	5 V	3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		QUAD	10 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
1893CKLFT	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
ATA6566-GBQW0	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
ATA6566-GBQW0-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm					3 mm
ATA6566-GBQW1	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
ATA6566-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm					3 mm
ATA663211-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
BCM89501BPBG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	176		SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	5											QUAD		S-PQFP-G176
CC3100R11MRGCR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
DP83848MPHPREP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HTFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Network Interfaces	.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G48	4	1.2 mm	7 mm		e4	30	260	7 mm
DP83TC814RRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm		e4		260	6 mm
DP83TC814SRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm		e4		260	6 mm
DS33Z11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE		PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified				14 mm
DS33Z11+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE		PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified	e1	30	260	14 mm
GD82559ER	Intel	ETHERNET TRANSCEIVER	OTHER	BALL	196	BGA	SQUARE		PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.75 mm	15 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	15 mm
GD82559ERSL3RB	Intel	ETHERNET TRANSCEIVER	OTHER	BALL	196	BGA	SQUARE		PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.75 mm	15 mm					15 mm
ICS1893CKLFT	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
KSZ8051MLLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1				1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm		e3	30	260	7 mm
KSZ8091RNBCA-G3XX	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32		.9 mm	5 mm		e4			5 mm
KSZ8091RNBCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm					5 mm
KSZ8692PBI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	400	BGA	SQUARE		PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.33 mm	27 mm	Not Qualified	e1			27 mm
MAX14819ATM+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE		UNSPECIFIED	YES	1		BICMOS				24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
MCP2021A-330E/MD	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
MCP2021A-330E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	4 mm					4 mm
SN55HVD251DRJR	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1	BICMOS		1	.065 mA	5 V	5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	Network Interfaces	.8 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	S-PDSO-N8	2	.8 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
1893CKLF	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
BCM53134SKFBG	Broadcom	SUPPORT CIRCUIT		BALL	256	BGA	SQUARE		PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY							BOTTOM		S-PBGA-B256	3						260
DP83848HSQ	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE		UNSPECIFIED	YES	1		CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N40		.8 mm	6 mm	Not Qualified				6 mm
E-STE100P	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
ICS1893CKLF	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
LAN8670B1T-E/LMX	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	32	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	10 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MCP2025-500E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
PTCAN1044DRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.