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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | CC3100R11MRGCR |
| Description | WIRELESS LAN CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | CC3100R11MRGCR Datasheet |
| In Stock | 15,455 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 64 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| JESD-30 Code: | S-PQCC-N64 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVQCCN |
| Width: | 9 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: |
296-39984-6 CC3100R11MRGCR-ND -296-39984-1-ND 296-39984-1 296-39984-2 |
| Telecom IC Type: | WIRELESS LAN CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | 9 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |









