SQUARE Network Interfaces 1,673

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS33X11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.5 mm	10 mm	Not Qualified		e1	30	260	10 mm
DS33X161+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1			17 mm
DS33X41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X42+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X81+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
KSZ8061RNBV	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
KSZ8441HLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ9031RNXUB	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
LAN8770RT-E/5KXVAO	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N36		.9 mm	6 mm						6 mm
NCV7344AMW3R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
VSC8512XJG-03	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				12		1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B672		2.44 mm	27 mm						27 mm
KSZ8051MNLU-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e4	40	260	5 mm
TNETE2201BPJWR	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.55SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	NOT SPECIFIED	260	10 mm
VSC8512XJG-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				12		1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B672		2.44 mm	27 mm						27 mm
BCM53134MIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
DP83848TSQ	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.8 mm	6 mm						6 mm
IP175GH	Ic Plus	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	48	HVSON	SQUARE	UNSPECIFIED	YES	1		CMOS		5		1.1 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-XQCC-N48		.9 mm	6 mm						6 mm
KSZ8051MNL-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e4			5 mm
ADIN1100BCPZ	Analog Devices	ETHERNET TRANSCEIVER		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	10 Mbps	S-XQCC-N40	3	.8 mm	6 mm		ESD FOR TXN, TXP, RXN, RXP Pins is 3B			260	6 mm
KSZ8061RNDV	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
KSZ8061RNDV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
LTC4257IDD#PBF	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
NCV7321MW2R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	8 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	S-XDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
SI4461-B1B-FMR	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TCAN1051DRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
VSC8572XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
88E1111-B2-CAA1I000	Marvell Technology	ETHERNET TRANSCEIVER		BUTT	96	BCC	SQUARE	UNSPECIFIED	YES	1		CMOS				1 V		CHIP CARRIER			.6 mm				BOTTOM		S-XBCC-B96		.8 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
LAN8770MT-E/PRAVAO	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
MCP2561FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
SX1211I084TRT	Semtech	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.03 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified		e3		260	5 mm
TJA1044VTK/3Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	110 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8	1	1 mm	3 mm					260	3 mm
BCM53134PKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
LAN8770M-E/PRAVAO	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
MC33907NAER2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1								FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm			e3	40	260	7 mm
NE83C92A	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS						CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
RTL8201CL-LF	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES			CMOS		1	120 mA	3.3 V	3.3	FLATPACK	QFP48,.35SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G48				Not Qualified
VSC8504XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	900 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
VSC8504XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm						17 mm
KSZ8051MNLU-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
KSZ8061RNBV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
PTCAN3413DRBR	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1			1	60 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
BCM53134PIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-45 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
DP83849IFVS	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2		3.3 V	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQFP-G80		1.2 mm	12 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	12 mm
DP83TD510ERHBR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	10 Mbps	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
E-STE100PTR	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm						10 mm
ICS1893CKILF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
KSZ8041NLAM	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32	2	.9 mm	5 mm	Not Qualified		e4	40	260	5 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.