SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC8541XMV-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					4		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	125 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N68		.9 mm	8 mm						8 mm
CYP15G0401DXB-BGXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
LAN83C185-JT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	40 mA	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3			10 mm
TCAN1044ADRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm		ESD Value for CANH, CANL wrt GND is 3B	e4		260	3 mm
ADIN1200BCP32Z	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm				30	260	5 mm
ATA663254-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
KSZ8999	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1				8		2.1 V		FLATPACK, FINE PITCH	QFP208,1.2SQ,20		.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G208		3.8 mm	28 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	28 mm
TLK105RHBR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.55,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
VSC8541XMV-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					4		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	125 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N68		.9 mm	8 mm						8 mm
MAX2837ETM+T	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	6 mm			e3	30	260	6 mm
MCP2544FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
PTLIN10285DRBRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V		SMALL OUTLINE				125 Cel	-40 Cel		DUAL	.1 Mbps	S-PDSO-N8
TLE9261BQXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm						7 mm
SI4463-B1B-FMR	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
RTL8211CL-GR	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES					1			1.05,2.5,3.3	FLATPACK	QFP48,.35SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G48				Not Qualified
TLE9250VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm			e3			3 mm
DM9161BEP	Davicom Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
LAN8820-ABZJ	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm			e3			8 mm
PCM9211PT	Texas Instruments	TOKEN RING TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					38 mA	3.3 V		FLATPACK			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
TJA1100HN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	27 mA	1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm		3.3V NOMINAL SUPPLY ALSO AVAILABLE		30	260	6 mm
MCP2021-330E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	4 mm			e3		260	4 mm
SI4463-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
AD9375BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm				30	260	12 mm
ATA663254-GBQW-V07	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
MCP2562FDT-E/MFVAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
VSC8501XML-03	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	135	VFLGA	SQUARE	PLASTIC/EPOXY	YES	1				1	165 mA	1 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SLGA135(UNSPEC)		.65 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	1000 Mbps	S-PBGA-N135		.85 mm	12 mm			e4			12 mm
FLLXT971ABE.A4-834104	Cortina Systems	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.11 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B64		1.36 mm	7 mm	Not Qualified			30	240	7 mm
KS8721BLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
TCAN1051HDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1028TK/3V3/20	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm						3 mm
WJLXT971ALC.A4	Intel	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	40	260	10 mm
KSZ8051RNLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm						5 mm
KSZ8061MNXI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3	30	260	5 mm
KSZ8851-16MLLJ	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.8 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified		e3			7 mm
LAN8820-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm			e3			8 mm
TCAN1051VDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
88E1514-A0-NNP2C000	Marvell Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
MC33FS6523CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm				40	260	7 mm
QT2025PRKDB-1	M/a-com Technology Solutions	MANCHESTER ENCODER	COMMERCIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.68 mm	13 mm			e1		260	13 mm
RTL8201BL-LF	Realtek Semiconductor	ETHERNET TRANSCEIVER		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	200 mA	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G48		1.7 mm	7 mm						7 mm
TLE9261BQXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm						7 mm
TCAN1042GVDRBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TCAN1057ADRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm		ESD Value for CANH, CANL wrt GND is 3B	e4		260	3 mm
AD9375BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm				30	260	12 mm
NCN5110MNTWG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm			e3	30	260	6 mm
PTCAN1044VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
SI4460-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
VSC8552XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.