SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AR8033-AL1A-R	Qualcomm	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1	113.7 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.8 mm	6 mm						6 mm
SJA1105PELY	NXP Semiconductors	SUPPORT CIRCUIT		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B159	3	1.5 mm	12 mm					260	12 mm
LTC2875IDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm			e3	30	260	3 mm
DP83620SQ/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		3.3 V	2.5/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100000 Mbps	S-XQCC-N48	2	.8 mm	7 mm	Not Qualified		e3	30	260	7 mm
ADIN1300BCPZ	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm			e3	30	260	6 mm
DP83825IRMQT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100000 Mbps	S-PQCC-N24	1	.8 mm	3 mm			e4	NOT SPECIFIED	260	3 mm
DP83640TVV	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	100000 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified		e0		260	7 mm
L6362ATR	STMicroelectronics	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						24 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.45 mm	125 Cel	-40 Cel	NICKEL PALLADIUM	DUAL		S-PDSO-N12	3	1 mm	3 mm			e4		260	3 mm
TJA1051TK/3	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.19,25		.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
TLK110PT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
AR8033-AL1A	Qualcomm	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1	113.7 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.8 mm	6 mm						6 mm
KSZ8851SNLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	.9 mm	5 mm	Not Qualified		e4		260	5 mm
RTL8211FD-CG	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N40		.9 mm	5 mm						5 mm
DP83849IVS/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2		3.3 V	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
KSZ8001LI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
AR8033-AL1B	Qualcomm	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1	113.7 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N48		.8 mm	6 mm						6 mm
TJA1100HNZ	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N36	1	1 mm	6 mm			e4	30	260	6 mm
DP83849IDVS/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2		3.3 V	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
KSZ8851SNL-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	2	.9 mm	5 mm	Not Qualified		e4			5 mm
ADIN1300CCPZ-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm			e3	30	260	6 mm
ATA6561-GBQW	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8		.9 mm	3 mm			e3			3 mm
KSZ8091RNBIA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
DP83848VYB/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100000 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified		e3	30	260	7 mm
WJLXT971ALE.A4SE001	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	2.5/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3			10 mm
LTC2875MPDD#PBF	Analog Devices	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm			e3	30	260	3 mm
88E1512-XX-NNP2I000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER							QUAD		S-XQCC-N56							NOT SPECIFIED	NOT SPECIFIED
TJA1029TK/20/1J	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	1	1 mm	3 mm			e4	30	260	3 mm
DP83826IRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1	53 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
KSZ8081RNBCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
KSZ9021RL	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
KSZ8081RNBCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
TJA1028TK/3V3/20/J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			e1	30	260	12 mm
ADIN1300CCPZ	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm			e3	30	260	6 mm
CR95HF-VMD5T	STMicroelectronics	ETHERNET TRANSCEIVER	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.0006 mA	3.3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
NCN5130MNTWG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm			e3	30	260	6 mm
88E1510-A0-NNB2C000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER						Tin (Sn)	QUAD		S-XQCC-N48						e3
TJA1101BHN/0Z	NXP Semiconductors	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		60 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm			e4		260	6 mm
DP83849IFVS/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2		3.3 V	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
KSZ9021RLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
TCAN1042HGVDRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
88E1512PB2-NNP2C000	Marvell Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	8 mm		Also require supply 3.3V				8 mm
TJA1044GTK/3	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm		ESD on pins CANH and CANL ESD is 8kV		NOT SPECIFIED	NOT SPECIFIED	3 mm
TCAN1042HDRBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TCAN1042HGVDRBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1029TK,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm				DUAL		S-PDSO-G8	1	1 mm	3 mm				30	260	3 mm
MCP2542FDT-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
RTL8211FSI-CG	Realtek Semiconductor	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N48		1 mm	6 mm						6 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.