SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADIN1200CCP32Z	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm				30	260	5 mm
LAN8820I-ABZJ	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm			e3			8 mm
TJA1044GTK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm		ESD on pins CANH and CANL ESD is 8kV		NOT SPECIFIED	NOT SPECIFIED	3 mm
14235R-500	Dialog Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE		UNSPECIFIED	YES	1				1	70 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	.078 Mbps	S-XQCC-N48		.9 mm	7 mm	Not Qualified					7 mm
KSZ8061MNGW-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N48		.9 mm	7 mm			e3			7 mm
MCP2562-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
TJA1042TK/3	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	.07 mA	5 V	5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Network Interfaces	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
MC33908NAE	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1								FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm			e3	40	260	7 mm
TCAN1462VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
KSZ8091RNDIA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24	2	.9 mm	4 mm			e3	30	260	4 mm
PTCAN1462VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
KSZ8091MNXCA-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
DJLXT971ALE.A4	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1						3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10 mm
MCP2542FDT-E/MFVAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
RTL8211E-VL-CG	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE		UNSPECIFIED	YES	1				1		1.05 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		1 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
DP83620SQE	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		.8 mm	7 mm						7 mm
KSZ8893MBLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE		PLASTIC/EPOXY	YES	1			TS 16949	2		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100	1	1.38 mm	9 mm	Not Qualified		e1			9 mm
LAN8820I-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm			e3			8 mm
TCAN1042GVDRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TCAN1044DRBRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG			.65 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
ATA6563-GBQW0	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
BCM53128KQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
PDP83TG720SWCSTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	4	260 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N36		1 mm	6 mm		ALSO OPERATES WITH 3.3 NOMINAL SUPPLY				6 mm
DP83TC811RWRNDTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
BCM5221A4KPTG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	QFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1		2.5 V		FLATPACK	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQFP-G64		1.6 mm	10 mm		ALSO OPERATES AT 3.3V SUPPLY		NOT SPECIFIED	NOT SPECIFIED	10 mm
TCAN1051VDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TLE9250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm			e3			3 mm
DP83848VYB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified					7 mm
KSZ9021GN	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE		UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-XQCC-N64	3	.9 mm	8 mm	Not Qualified		e4	30	260	8 mm
RTL8201CL-VD-LF	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	QFP	SQUARE		PLASTIC/EPOXY	YES			CMOS		1	120 mA	3.3 V	3.3	FLATPACK	QFP48,.35SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G48				Not Qualified
TJA1028TK/3V3/10,1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1028TK/3V3/10:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
VSC8552XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE		PLASTIC/EPOXY	YES	1				2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
KSZ8873MLLJ	Microchip Technology	LAN SWITCHING CIRCUIT	AUTOMOTIVE			LFQFP	SQUARE				1						1.8 V					.5 mm	125 Cel	-40 Cel	MATTE TIN					1.6 mm	10 mm			e3			10 mm
VSC8541XMVRT-HP	Microchip Technology	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	68	HVQCCN	SQUARE	100k Rad(Si)	PLASTIC/EPOXY	YES	1			AEC-Q100	1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	125 Cel	-55 Cel		QUAD	1000 Mbps	S-PQCC-N68		.9 mm	8 mm						8 mm
MCP2542WFDT-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
KSZ8893MBL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	100	LFBGA	SQUARE		PLASTIC/EPOXY	YES	1			TS 16949	2		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32		.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100		1.38 mm	9 mm	Not Qualified		e1			9 mm
WJLXT905LE.C2	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS				5 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e3			7 mm
KSZ8041RNL-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1		CMOS		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	.9 mm	5 mm	Not Qualified		e3	30	260	5 mm
TLIN10285DRBRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	SQUARE		PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V		SMALL OUTLINE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2					e4	30	260
KSZ8001L-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1		CMOS		1		1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
LAN8671B1-E/U3B	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	24	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	10 Mbps	S-PQCC-N24		.9 mm	4 mm						4 mm
ATA663254-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
KSZ8091MLXCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE		PLASTIC/EPOXY	YES	1			TS 16949	1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ8091MNXCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
LAN8710AI-EZC	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE		UNSPECIFIED	YES	1		CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
SI4460-B1B-FMR	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE		UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20	1	.9 mm	4 mm				40	260	4 mm
TLE92613BQXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE		PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm						7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.