SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LAN8810-AKZE	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V	1.2,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N72		1 mm	10 mm	Not Qualified	e3			10 mm
MCP2561T-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
NCV7342MW3R2G	Onsemi	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1	.075 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
PTCAN3414DRBR	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1			1	60 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
PX1011BI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
SI4468-A2A-IM	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
TLE92613BQXV33XUMA2	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQCC-N48	3	.9 mm	7 mm					7 mm
TUSB1210BRHBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	2	1 mm	5 mm		e4	NOT SPECIFIED	260	5 mm
VSC8489YJU-02	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2	150 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
VSC8662XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm					17 mm
AT86RF230-ZU	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	.25 Mbps	S-XQCC-N32		1 mm	5 mm					5 mm
MCP2025T-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
88E1121RA0-TFE1C000	Marvell Technology	ETHERNET TRANSCEIVER		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.2 V		FLATPACK							QUAD		S-PQFP-G100						NOT SPECIFIED	NOT SPECIFIED
DP83955AV	National Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			250 mA	5 V	5	CHIP CARRIER	LDCC84,1.2SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J84				Not Qualified	e0
88X2222-B0-BKP2C000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		GRID ARRAY	BGA324,18X18,40		1 mm	70 Cel	0 Cel		BOTTOM	10300 Mbps	S-PBGA-B324		2.82 mm	19 mm					19 mm
BCM53125MIMMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	186		SQUARE	PLASTIC/EPOXY	YES	1				1					BGA186(UNSPEC)						BOTTOM		S-PBGA-B186	3
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm		e1			17 mm
CYP15G0403DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
MAX2829ETN	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
BCM82793AKFSBG	Broadcom	SUPPORT CIRCUIT					SQUARE					CMOS														25000 Mbps
CYP15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
EZX557AT2SLKVX	Intel	SUPPORT CIRCUIT	COMMERCIAL	BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY				55 Cel	0 Cel		BOTTOM	10000 Mbps	S-PBGA-B						NOT SPECIFIED	NOT SPECIFIED
NCV7357MW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	105 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
SI4464-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e3			4 mm
SI4467-A2A-IMR	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY85334-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		BALL	16	BGA	SQUARE	UNSPECIFIED	YES	1								GRID ARRAY							BOTTOM		S-XBGA-B16						NOT SPECIFIED	NOT SPECIFIED
TLE9271QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
BCM54991LB0IFEBG	Broadcom	ETHERNET TRANSCEIVER		BALL			SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		.8 V									BOTTOM	5000 Mbps	S-PBGA-B
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
MAX4890EETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4890EETJ+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
SI4461-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm					4 mm
SI4464-B1B-FMR	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e3			4 mm
LXT905PC	Intel	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.1 mA	5 V	3.3/5	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	10 Mbps	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified	e3	40	260	11.5062 mm
MC33665ATS4AE	NXP Semiconductors	CAN FD TRANSCEIVER		GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1				FLATPACK				125 Cel	-40 Cel		QUAD	10 Mbps	S-PQFP-G48	3					40	260
SKY85337-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		UNSPECIFIED	16		SQUARE	UNSPECIFIED	NO	1								MICROELECTRONIC ASSEMBLY							UNSPECIFIED		S-XXMA-X16						NOT SPECIFIED	NOT SPECIFIED
WGI217LMSLJWF	Intel	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.9 mm	6 mm					6 mm
88E1111-B2-CAA1C000	Marvell Technology	ETHERNET TRANSCEIVER		BUTT	96	BCC	SQUARE	UNSPECIFIED	YES	1		CMOS		1		1 V	1,2.5	CHIP CARRIER	SLGA96,15X15,24	Network Interfaces	.6 mm				BOTTOM	1000 Mbps	S-XBCC-B96		.8 mm	9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9 mm
88E3082-B1-BAR-I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	224	BGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY							BOTTOM		S-PBGA-B224
BCM52311A1HH0H275S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM53158XUB1KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	311	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B311	3	1.337 mm	13 mm		e1			13 mm
BCM84848A1KFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY							BOTTOM		S-PBGA-B484						NOT SPECIFIED	NOT SPECIFIED
BCM84881B0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL			SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		1 V									BOTTOM	10000 Mbps	S-PBGA-B	3						260
BCM88470CB0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	1365		SQUARE	PLASTIC/EPOXY	YES	1									BGA1365(UNSPEC)						BOTTOM		S-PBGA-B1365	4						245
CYW15G0403DXB-BGI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
LXT905LC	Intel	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.1 mA	5 V	3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Network Interfaces	.8 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	10 Mbps	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
WGI217LMSLJWE	Intel	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.9 mm	6 mm					6 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.