SQUARE Network Interfaces 1,673

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLE7250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm			e3			3 mm
TLE9261QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm						7 mm
VSC8522XJQ-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	302	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1							1 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G302		1.2 mm	24 mm						24 mm
VSC8658XHJ	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	444	BGA	SQUARE	PLASTIC/EPOXY	YES	1					8		1.2 V		GRID ARRAY	BGA444,26X26,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B444		2.36 mm	27 mm		IT ALSO OPERATS AT 3.3V, SEATED HT-CALCULATED				27 mm
78Q8392L-28CH/F	Analog Devices	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	28	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		-9 V	1	.065 mA	9 V	+-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	10 Mbps	S-PQCC-N28		4.572 mm	11.5316 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
ADIN2111BCPZ	Analog Devices	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	40000 Mbps	S-XQCC-N48	3	.8 mm	7 mm				30	260	7 mm
ADIN2111BCPZ-R7	Analog Devices	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	40000 Mbps	S-XQCC-N48	3	.8 mm	7 mm				30	260	7 mm
ATA6560-GBQW	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8		.9 mm	3 mm			e3			3 mm
ATA6560-GBQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
BCM8727BIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE	PLASTIC/EPOXY	YES						1		1 V									BOTTOM		S-PBGA-B324	3							260
BCM8727CIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	324		SQUARE	PLASTIC/EPOXY	YES						1		1 V									BOTTOM		S-PBGA-B324
DP83848JSQ	National Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS			1		3.3 V	3.3	CHIP CARRIER	LCC40,.24SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQCC-N40	2			Not Qualified			40	260
DP83848VYBX	National Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES			CMOS			1		3.3 V	3.3	FLATPACK	QFP48,.35SQ,20	Network Interfaces	.5 mm	105 Cel	-40 Cel	TIN LEAD	QUAD	100 Mbps	S-PQFP-G48	3			Not Qualified		e0	40	260
DP83848YBX	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES			CMOS			1		3.3 V	3.3	FLATPACK	QFP48,.35SQ,20	Network Interfaces	.5 mm	125 Cel	-40 Cel		QUAD	100 Mbps	S-PQFP-G48				Not Qualified
DP83TC812SRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TD510ERHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	10 Mbps	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
HI-1582PCIF	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	1 mm	7 mm			e4		260	7 mm
KSZ8051RNLU-TR-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
KSZ8091MLXIA	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ8842-16MVLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3			14 mm
KSZ8895MLU	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G128		1.6 mm	14 mm	Not Qualified		e3			14 mm
LAN8741AI-EN-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N32		1 mm	5 mm			e3			5 mm
LTC2875MPDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm			e3	30	260	3 mm
MAX2829ETN-T	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+T	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm			e3	30	260	8 mm
MC33FS4508CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS4508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100		1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MCP2542WFD-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
MCP2542WFDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
NCV7344MW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
PN5331B3HN/C270:55	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified		e4		260	6 mm
PTCAN1462DRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
RTL8201BL	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES			CMOS			1		3.3 V	3.3	FLATPACK	QFP48,.35SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G48				Not Qualified
TCAN1051DRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1021TK/10/C/S90	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm						3 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm			e3			3 mm
TLE7250VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm			e3			3 mm
TLK106LRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1					4		1.55 V		CHIP CARRIER				105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2					e4	NOT SPECIFIED	260
TLK1211RCP	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.113 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
VSC8489YJU-13	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1							1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
VSC8552XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1							1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8584XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
WJLXT972ALC.A4SE000	Intel	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3			10 mm
1893CKILF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
BCM53128IQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-45 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
KSZ8081RNDCA-G3XX	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24		.9 mm	4 mm			e3			4 mm
KSZ8081RNDCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24		.9 mm	4 mm			e3			4 mm
KSZ8091MLXCA-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.