Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.065 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
4.9 mm |
||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
|||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
|||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
260 |
4.9 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
260 |
4.9 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
4.9 mm |
||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
8.65 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
|||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
|||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
|||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HTSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.15 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.16 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||
Atmel |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
1 |
.06 mA |
5 V |
5 |
SMALL OUTLINE, LOW PROFILE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.65 mm |
3.8 mm |
Not Qualified |
e0 |
4.925 mm |
||||||||||
|
Intel |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
0 Cel |
DUAL |
R-PDSO-G48 |
2.74 mm |
7.5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
15.85 mm |
||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.072 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.072 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
81 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B81 |
3 |
1.6 mm |
9 mm |
Not Qualified |
260 |
9 mm |
||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.25 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
8.65 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
||||||||||||||||||
Intel |
INTERFACE CIRCUIT |
BALL |
324 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
GRID ARRAY |
BGA324(UNSPEC) |
BOTTOM |
R-PBGA-B324 |
||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.075 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
2 |
1.7272 mm |
3.937 mm |
Not Qualified |
e3 |
30 |
260 |
4.9276 mm |
||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
|||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
TIN |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.045 mA |
13 V |
12 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
.1 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
30 |
260 |
4.9 mm |
||||||||
Intel |
INTERFACE CIRCUIT |
BALL |
324 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BOTTOM |
R-PBGA-B324 |
||||||||||||||||||||||||||||||
|
Atmel |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
1 mm |
5 mm |
Not Qualified |
5 mm |
|||||||||||||||||||
|
Atmel |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
5,7/32 |
SMALL OUTLINE |
SOP16,.25 |
Network Interfaces |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.25 Mbps |
R-PDSO-G16 |
1 |
1.75 mm |
3.8 mm |
Not Qualified |
e3 |
260 |
9.9 mm |
|||||||||
|
ROHM |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
|
ROHM |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.65 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||
|
ROHM |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.65 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.5 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e1 |
20 |
260 |
11 mm |
||||||
Intersil |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
IN-LINE |
2.54 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.33 mm |
7.62 mm |
Not Qualified |
e0 |
19.17 mm |
||||||||||||||||
Freescale Semiconductor |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.018 mA |
13.5 V |
5.5/18 |
SMALL OUTLINE |
SOP28,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.125 Mbps |
R-PDSO-G28 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
30 |
240 |
17.925 mm |
||||||||
Intel |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.