LIN TRANSCEIVER Network Interfaces 145

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1021TK/20/C,118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8	1	.8 mm	3 mm				30	260	3 mm
NCV7321D12R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	8 mA	12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm			e3	30	260	4.9 mm
TJA1021T/20/CM,118	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm				30	260	4.9 mm
TJA1021T/10/C,118	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4		260	4.9 mm
TJA1021T/20/C,118	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
TJA1021T/20/C,112	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4		260	4.9 mm
TJA1028TK/5V0/20/J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-N8	1	1 mm	3 mm			e4	30	260	3 mm
TJA1027TK/20/1J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm				DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1027TK/20,118	NXP Semiconductors	LIN TRANSCEIVER																							1						30	260
TJA1021TK/10/C,118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8	1	.8 mm	3 mm					260	3 mm
TJA1021T/10/CM,118	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
TJA1028T/3V3/20/1J	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
MCP2003B-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e3	40	260	4.9 mm
TJA1028TK/3V3/20/J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1028TK/5V0/20:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				30	260	3 mm
TJA1028TK/5V0/20,1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				30	260	3 mm
PTLIN1021ADRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	AEC-Q100	1	6.5 mA	8 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL	.02 Mbps	R-PDSO-G8		1.75 mm	3.895 mm		ESD for VSUP, INH, WAKE and LIN pins is 3B; Data rates 100 kbps for RX, 20kbps for TX				4.905 mm
TLIN1021ADRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	AEC-Q100	1	6.5 mA	5.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm			e4		260	4.9 mm
TJA1028TK/3V3/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1028T/5V0/10:11	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
TJA1028T/5V0/10,11	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
MCP2003-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
MCP2003B-E/SNVAO	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
TJA1028TK/5V0/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
MCP2003-E/MD	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm						4 mm
TJA1028T/5V0/20/DZ	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
MCP2003BT-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MCP2003-E/P	Microchip Technology	LIN TRANSCEIVER		THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		TS 16949	1		12 V	IN-LINE	DIP8,.3	2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.33 mm	7.62 mm						9.27 mm
MCP2003B-H/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MCP2003B-E/MC	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8		1 mm	2 mm						3 mm
TJA1028TK/3V3/10,1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
TJA1028TK/3V3/10:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
ATA663254-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
ATA663254-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
ATA6631-GAQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	53 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.8 mm	3.9 mm			e4			4.9 mm
MCP2021-330E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	4 mm			e3		260	4 mm
ATA663254-GBQW-V07	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
TLIN2027DRBRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1	AEC-Q100	1	5 mA	14 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
ATA663211-GAQW-V10	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8		1.8 mm	3.9 mm						4.9 mm
MCP2003B-E/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm						3 mm
ATA663254-GAQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8		1.75 mm	3.9 mm			e4			4.9 mm
TJA1021TK/20,118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm						3 mm
MCP2021AT-330E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	4 mm						4 mm
MCP2003A-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
TJA1022TK,118	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	14	HVSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH		.65 mm				DUAL		R-PDSO-G14	1	1 mm	3 mm				30	260	4.5 mm
ATA6662C-GAQW	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	2 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.8 mm	3.9 mm				40	260	4.9 mm
NCV7321MW2R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	1	8 mA	12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	S-XDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1022T,118	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V	SMALL OUTLINE		1.27 mm				DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm				30	260	8.65 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.