LIN TRANSCEIVER Network Interfaces 145

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ATA663211-GAQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.27 mm	3.9 mm		e4			4.9 mm
BD41030HFN-CGTR	ROHM	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-N8		.6 mm	2.8 mm			NOT SPECIFIED	NOT SPECIFIED	2.9 mm
TLIN1029ADRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	5 mA	5.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4	30	260	4.9 mm
TLIN2029ADRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	5 mA	12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4	30	260	4.905 mm
BD41030FJ-CGE2	ROHM	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	LSOP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			12 V	SMALL OUTLINE, LOW PROFILE		1.27 mm	125 Cel	-40 Cel		DUAL		S-PDSO-G8		1.65 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
TJA1027T/20/2Z	NXP Semiconductors	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4 mA	12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TJA1028T/3V3/10:11	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TLIN1024ARGYRQ1	Texas Instruments	LIN TRANSCEIVER		NO LEAD	24	HVFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	4		AEC-Q100	4	7.5 mA	8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.14X.21,20	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.02 Mbps	R-PQCC-N24	2	1 mm	3.5 mm		e4		260	5.5 mm
NCV7329D10R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1	6.5 mA	12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm		e3	30	260	4.9 mm
ATA663454-GDQW-VAO	Microchip Technology	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.5 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-N16		1 mm	3 mm		e3			5.5 mm
MCP2003BT-E/MC	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8		1 mm	2 mm					3 mm
MCP2025-500E/P	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949	1		12 V	IN-LINE	DIP8,.3	2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.334 mm	7.62 mm		e3			9.271 mm
ATA663454-GDQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1.15 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N16		.9 mm	3 mm		e3			5.5 mm
ATA6663-GAQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					2 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.8 mm	3.9 mm		e4			4.9 mm
MCP2025-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
ATA663254-GAQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm		e4			4.9 mm
ATA6663-FAQW-1	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					2 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		.9 mm	3 mm		e3			3 mm
ATA663231-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
TLIN2027DRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	5 mA	14 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	4.905 mm		e4	30	260	3.895 mm
ATA663231-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
TLE7257LEXUMA1	Infineon Technologies	LIN TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100	1		7 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL	.02 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
MCP2021AT-500E/SNVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
NCV7327MW0R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	6.5 mA	12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	S-XDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
ATA663211-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
MCP2003BT-E/SNVAO	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MCP2021A-330E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	4 mm					4 mm
MCP2022-330E/SL	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP14,.25	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G14		1.75 mm	3.9 mm		e3			8.65 mm
MCP2003AT-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2022-500E/SL	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP14,.25	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G14		1.75 mm	3.9 mm		e3			8.65 mm
MCP2025-500E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
MCP2003-E/SNVAO	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MCP2004A-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
TJA1021T/10/C,112	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4		260	4.9 mm
TJA1021TK/10/C/S90	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm					3 mm
UJA1018TK	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25	.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N16		1 mm	5.5 mm					3.5 mm
MCP2021-330E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3		260	4.9 mm
MCP2021-500E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3		260	4.9 mm
TLIN10283DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	6.1 V	SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TLIN10285DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	6.1 V	SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MCP2025T-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
MCP2025-330E/P	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949	1		12 V	IN-LINE	DIP8,.3	2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.334 mm	7.62 mm		e3			9.271 mm
ATA6624C-PGQW-1	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	53 mA		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.2SQ,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20		.9 mm	5 mm		e3			5 mm
ATA663255-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm		e3			3 mm
MCP2003BT-H/MF	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
MCP2003T-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		7 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2004-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2004T-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
MCP2021T-330E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e3			4.9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.