OTHER Network Interfaces 85

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ISO1050DUBR	Texas Instruments	INTERFACE CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			2.54 mm	105 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	4	4.85 mm	6.62 mm	Not Qualified		e4	30	260	9.15 mm
RN131G-I/RM	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm				NOT SPECIFIED	NOT SPECIFIED	37 mm
ISO1050DUB	Texas Instruments	INTERFACE CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			2.54 mm	105 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	4	4.85 mm	6.62 mm	Not Qualified		e4	30	260	9.15 mm
ISO1050DWR	Texas Instruments	INTERFACE CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	10.3 mm
ISO1050DW	Texas Instruments	INTERFACE CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	10.3 mm
CR95HF-VMD5T	STMicroelectronics	ETHERNET TRANSCEIVER	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.0006 mA	3.3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
NCN5120MNTWG	Onsemi	ETHERNET TRANSCEIVER	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-25 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified		e3	30	260	6 mm
VSC8541XMV-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	125 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N68		.9 mm	8 mm						8 mm
CC3100MODR11MAMOBR	Texas Instruments	WIRELESS LAN CIRCUIT	OTHER	BUTT	63	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		3.3 V		GRID ARRAY			1.27 mm	70 Cel	-20 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B63	3	2.38 mm	17.5 mm			e4	30	260	20.5 mm
VSC8531XMW-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	125 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N48		.9 mm	6 mm						6 mm
VSC8211XVW	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	324 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA117,9X13,40		1 mm	100 Cel	0 Cel		BOTTOM	1000 Mbps	R-PBGA-B117		1.7 mm	10 mm						14 mm
VSC8514XMK-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4	605 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25		.65 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBCC-N138		.85 mm	12 mm						12 mm
VSC8514XMK	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4	605 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25		.65 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PQCC-N138		.85 mm	12 mm						12 mm
CC3100MODR11MAMOBT	Texas Instruments	WIRELESS LAN CIRCUIT	OTHER	BUTT	63	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		3.3 V		GRID ARRAY			1.27 mm	70 Cel	-20 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B63	3	2.38 mm	17.5 mm			e4	30	260	20.5 mm
14212R-500	Dialog Semiconductor	MANCHESTER ENCODER/DECODER	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32		2.9972 mm	11.303 mm			e4			20.447 mm
VSC8541XMV-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES			4		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	125 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N68		.9 mm	8 mm						8 mm
ADM3057ETRWZ-EP-RL	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-55 Cel	MATTE TIN	DUAL		R-PDSO-G20	3	2.65 mm	7.5 mm			e3		260	12.8 mm
ADM3057ETRWZ-EP	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-55 Cel	MATTE TIN	DUAL		R-PDSO-G20	3	2.65 mm	7.5 mm			e3		260	12.8 mm
VSC8552XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
14230R-450	Dialog Semiconductor	MANCHESTER ENCODER/DECODER	OTHER	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64		1.6 mm	14 mm			e4			14 mm
NCN5120MNG	Onsemi	ETHERNET TRANSCEIVER	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-25 Cel		QUAD		S-XQCC-N40		1 mm	6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6 mm
VSC8575XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8564XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8512XJG-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1		12		1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC8572XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
AQR108-B0-EG-Y	Marvell Technology	ETHERNET TRANSCEIVER	OTHER	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	108 Cel	0 Cel		BOTTOM		R-PBGA-B104		1.57 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
VSC8504XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	900 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
VSC8572XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
RN131G-I/RM475	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm				NOT SPECIFIED	NOT SPECIFIED	37 mm
WGI218LM/SLK3B	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	Network Interfaces	.4 mm	85 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.9 mm	6 mm	Not Qualified					6 mm
VSC8574XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	980 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8584XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8552XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
WGI219LMSLKJ3	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N48		.9 mm	3 mm						3 mm
FT3150-P20	Renesas Electronics	MANCHESTER ENCODER/DECODER	OTHER	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-25 Cel		QUAD		S-PQFP-G64		1.6 mm	14 mm					235	14 mm
VSC8504XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
GD82559ER	Intel	ETHERNET TRANSCEIVER	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.75 mm	15 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	15 mm
GD82559ERSL3RB	Intel	ETHERNET TRANSCEIVER	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.75 mm	15 mm						15 mm
RN131G-I/RM481	Microchip Technology	WIRELESS LAN CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1	HYBRID			3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		QUAD		R-XQMA-N44		3.5 mm	20 mm						37 mm
RN131G-I/RM475PSW	Microchip Technology	WIRELESS LAN CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1	HYBRID			3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		QUAD		R-XQMA-N44		3.5 mm	20 mm						37 mm
VSC8658XHJ	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	444	BGA	SQUARE	PLASTIC/EPOXY	YES	1		8		1.2 V		GRID ARRAY	BGA444,26X26,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B444		2.36 mm	27 mm		IT ALSO OPERATS AT 3.3V, SEATED HT-CALCULATED				27 mm
PN5331B3HN/C270:55	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified		e4		260	6 mm
EP82562G	Intel	INTERFACE CIRCUIT	OTHER	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	0 Cel		DUAL		R-PDSO-G48		2.74 mm	7.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	15.85 mm
RN-131G	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm				NOT SPECIFIED	NOT SPECIFIED	37 mm
VSC8662XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm						17 mm
WG82567LMSLAVV	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES			1			1.05,1.8,3.3	CHIP CARRIER	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N56	1			Not Qualified		e3
WG82567V/SLAW7	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES			1			1.05,1.8,3.3	CHIP CARRIER	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N56	1			Not Qualified		e3
VSC8664XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.