Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
260 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
1.2 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA260,18X18,40 |
1 mm |
100 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1000 Mbps |
S-PBGA-B260 |
4 |
2 mm |
19 mm |
e1 |
30 |
260 |
19 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1130 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
|||||||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.23 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Network Interfaces |
1.27 mm |
100 Cel |
-55 Cel |
QUAD |
16 Mbps |
S-PQCC-J44 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
GRID ARRAY |
1 mm |
BOTTOM |
S-PBGA-B289 |
2 mm |
19 mm |
Not Qualified |
19 mm |
|||||||||||||||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
200 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Network Interfaces |
1.27 mm |
99 Cel |
0 Cel |
QUAD |
16 Mbps |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
16.5862 mm |
|||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
9.9 mm |
||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
GRID ARRAY |
1 mm |
75 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B289 |
2 mm |
19 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
GRID ARRAY |
BOTTOM |
S-PBGA-B289 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
200 mA |
5 V |
CHIP CARRIER |
1.27 mm |
99 Cel |
0 Cel |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
16.5862 mm |
||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
4 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
4 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
||||||||||
|
NXP Semiconductors |
SUPPORT CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
Not Qualified |
e4 |
260 |
6 mm |
||||||||||||||
NXP Semiconductors |
SUPPORT CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
1 mm |
6 mm |
Not Qualified |
6 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
138 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
0 Cel |
QUAD |
S-PQCC-N138 |
.85 mm |
12 mm |
12 mm |
||||||||||||||||||||
Infineon Technologies |
ETHERNET TRANSCEIVER |
OTHER |
UNSPECIFIED |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
FIBER OPTIC |
85 Cel |
0 Cel |
UNSPECIFIED |
R-XXFO-X |
Not Qualified |
|||||||||||||||||||||||||
Infineon Technologies |
ETHERNET TRANSCEIVER |
OTHER |
UNSPECIFIED |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
FIBER OPTIC |
85 Cel |
0 Cel |
UNSPECIFIED |
R-XXFO-X |
Not Qualified |
|||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-XQCC-N44 |
.8 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
68 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-5 Cel |
TIN LEAD |
QUAD |
S-XQCC-N68 |
.9 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
68 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.62 mA |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC68,.4SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-5 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-N68 |
.9 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N44 |
3 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N44 |
3 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||||
Renesas Electronics |
MANCHESTER ENCODER/DECODER |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G32 |
2.9972 mm |
11.303 mm |
20.447 mm |
||||||||||||||||||||
Renesas Electronics |
MANCHESTER ENCODER/DECODER |
OTHER |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
10 mm |
||||||||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
64 |
QFP |
SQUARE |
METAL |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK |
.8 mm |
85 Cel |
0 Cel |
QUAD |
S-MQFP-G64 |
2.35 mm |
13.8 mm |
Not Qualified |
13.8 mm |
||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
OTHER |
UNSPECIFIED |
9 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
FIBER OPTIC |
85 Cel |
-10 Cel |
UNSPECIFIED |
R-XXFO-X9 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
64 |
QFP |
SQUARE |
METAL |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK |
.8 mm |
85 Cel |
0 Cel |
QUAD |
S-MQFP-G64 |
2.35 mm |
13.8 mm |
Not Qualified |
13.8 mm |
||||||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
64 |
QFP |
SQUARE |
METAL |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK |
.8 mm |
85 Cel |
0 Cel |
QUAD |
S-MQFP-G64 |
2.35 mm |
13.8 mm |
Not Qualified |
13.8 mm |
||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
OTHER |
UNSPECIFIED |
9 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
FIBER OPTIC |
85 Cel |
-10 Cel |
UNSPECIFIED |
R-XXFO-X9 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
OTHER |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
8 |
892 mA |
2.5,2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Network Interfaces |
1 mm |
70 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B256 |
Not Qualified |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.