Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
e4 |
5 mm |
||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
UNSPECIFIED |
12 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDMA-X12 |
17.78 mm |
e3 |
27.94 mm |
|||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
980 mA |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
TS 16949 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-PQCC-N24 |
.9 mm |
4 mm |
4 mm |
||||||||||||||||||
|
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
NICKEL GOLD |
DUAL |
R-XDMA-N49 |
3.175 mm |
17.78 mm |
e4 |
26.67 mm |
|||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
GRID ARRAY |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1000 Mbps |
S-XQCC-N64 |
3 |
.9 mm |
8 mm |
e4 |
30 |
260 |
8 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
4 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
105 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQCC-N64 |
.9 mm |
8 mm |
8 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
|||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N68 |
3 |
.9 mm |
8 mm |
e3 |
260 |
8 mm |
||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
NO LEAD |
16 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.5 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC16,.13,25 |
.65 mm |
150 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-N16 |
1 mm |
3 mm |
e3 |
5.5 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N8 |
1 mm |
2 mm |
3 mm |
||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
12 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.334 mm |
7.62 mm |
e3 |
9.271 mm |
||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
70 mA |
5 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDIP-T8 |
5.334 mm |
7.62 mm |
e3 |
9.271 mm |
||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
OTHER |
NO LEAD |
44 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2 mm |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N44 |
3.5 mm |
20 mm |
NOT SPECIFIED |
NOT SPECIFIED |
37 mm |
||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
95 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
10518.75 Mbps |
S-PBGA-B256 |
3.22 mm |
17 mm |
e1 |
17 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
16 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1.15 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N16 |
.9 mm |
3 mm |
e3 |
5.5 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 mA |
13.5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.8 mm |
3.9 mm |
e4 |
4.9 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
40 |
260 |
5 mm |
||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.4 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G128 |
1.2 mm |
14 mm |
14 mm |
|||||||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
e3 |
14 mm |
|||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
.8 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
4 mm |
e3 |
4 mm |
||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
800 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
980 mA |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1890 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
1 mm |
7 mm |
7 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.95 mA |
13.5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e4 |
4.9 mm |
|||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
58.3 mA |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
.5 mm |
70 Cel |
0 Cel |
QUAD |
.0001 Mbps |
S-PQFP-G48 |
1.2 mm |
7 mm |
40 |
260 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.