NXP Semiconductors Network Interfaces 1,733

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC33FS6517LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
TJA1054T/N1	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	.125 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8.65 mm
MC33FS6504LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER																									3						40	260
TJA1041U	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP							UPPER		R-XUUC-N14				Not Qualified
MC33663ASEFR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm			e3	40	260	8.65 mm
TJA1020T/S490,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
TJA1051T	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE	SOP8,.24		1.27 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
TJA1046VTKZ	NXP Semiconductors	INTERFACE CIRCUIT																					NICKEL PALLADIUM GOLD SILVER				1					e4	30	260
UJA1162ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm		ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B				4.5 mm
TJA1049TK/3	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm						3 mm
MC33FS6522CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3						40	260
TJA1051T/1U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
MC33FS6507NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS6506NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS4505CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS4501CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER																									3						40	260
MC33FS6505CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS4507NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
TJA1080TS/N	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified		e4			7.2 mm
MC33FS6517LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33FS6502NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3						40	260
TJA1040T/N,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	75 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
TJA1053T/N,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e0			8.65 mm
TJA1051T/3/1U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
UJA1061TW/3V3	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified		e3			11 mm
MC33662JEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	4.9 mm
MC33663ALEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm			e3	40	260	8.65 mm
TJA1054T/S430/VM,5	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	27 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm				DUAL	.125 Mbps	R-PDSO-G14				Not Qualified
TJA1441AT	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
UJA1069TW24/5V0,11	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	6.1 mm						11 mm
MC33FS4502LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3						40	260
MC33FS6503NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3						40	260
MC33FS4507KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MC33389CDWR2	NXP Semiconductors	INTERFACE CIRCUIT																					TIN LEAD				3					e0	30	220
UJA1069TW24/5V0/S5	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	6.1 mm						11 mm
UJA1061TW/5V0	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified		e3			11 mm
NTS0101GM,115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm			e3	30	260	1.45 mm
UJA1069TW/5V0,518	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm						11 mm
MC33901SEFR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	4.9 mm
TJA1054AT/N,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e0			8.65 mm
TJA1027T	NXP Semiconductors	INTERFACE CIRCUIT
UJA1066TW/3V3/T,51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100					SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm					260	11 mm
TJA1021TK/10,118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm						3 mm
MC33FS6500CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3						40	260
MC33399PEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e3	40	260	4.9 mm
TJA1054U/N1,005	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP							UPPER		R-XUUC-N15				Not Qualified
TJA1442AT	NXP Semiconductors	CAN TRANSCEIVER
UJA1061TW/3V3,518	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm						11 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.