NXP Semiconductors Network Interfaces 1,733

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1050U/N1,005	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified
TJA1054AT/N/S900,1	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
UJA1061TW/3V0,512	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm					11 mm
TJA1028T/3V3/20	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
MC33FS6508CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33901SNEFR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8				Not Qualified
UJA1066TW/3V3/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100					SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm		e4	30	260	11 mm
MC33FS6504LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER																									3					40	260
MC33889DPEG	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	40	260	17.925 mm
TJA1441DTK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N8		1 mm	3 mm					3 mm
TJA1041T/N1,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
UJA1069TW/5V0	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified	e3			11 mm
MC33FS4507CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6525NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1054AU,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N15
MC33FS6515LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6523CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm			40	260	7 mm
NTS0101GF,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.5 mm	1 mm		e3	30	260	1 mm
TJA1102SHN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm					8 mm
MC33907AE	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
MC33389DDWR2	NXP Semiconductors	INTERFACE CIRCUIT																					TIN LEAD				3				e0	30	220
MC33FS6526CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4505NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
UJA1061TW	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.027 mA		5.5/27,5.5/52	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP32,.3	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified	e3			11 mm
MC33FS6516NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1041AT-T	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
MCZ33897TEF	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		12 V	6/26	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.08333 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	8.65 mm
MC33FS6525LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1083TTJ	NXP Semiconductors	FLEXRAY TRANSCEIVER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	60 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	Network Interfaces	.635 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	10 Mbps	R-PDSO-G14	1			Not Qualified	e4	30	260
NTS0101GM	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
TJA1080TS,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G20		2 mm	5.3 mm					7.2 mm
TJA1054T/S900M,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
TJA1054T/S430,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	2	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
MC33FS6512LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
TJA1054T/S430/N,51	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
UJA1061TW/5V0,518	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm					11 mm
TJA1054AT,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
TJA1054AT,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
TJA1028T/3V3/20:11	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1441BTK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N8		1 mm	3 mm					3 mm
MC33FS6520NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
TJA1022TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14	1	1 mm	3 mm			30	260	4.5 mm
TJA1040TD-T	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
NTS0101GW	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	PURE TIN	DUAL		R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified				2 mm
MC33662JEFR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
TJA1021U/20	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100; AEC-Q101			12 V		UNCASED CHIP							UPPER		R-XUUC-N
TJA1441DT	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
TJA1041AU/V,006	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.