NXP Semiconductors Network Interfaces 1,733

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1049T/3	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
UJA1065TW/3V0,512	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm	Not Qualified	e3			11 mm
PCA82C252T-T	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
MC33FS6527CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1041AT/M,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
TJA1080TS/N,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G20		2 mm	5.3 mm					7.2 mm
UJA1069TW24/3V3/C	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	6.1 mm					11 mm
MC33CM0902WEFR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2	.13 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	8.65 mm
MC33662SEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
MC33FS6521NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
TJA1054AT,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.125 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
MC33989PEGR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	40	260	17.925 mm
TJA1040T/N1M,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	70 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm				DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TJA1044VT	NXP Semiconductors	INTERFACE CIRCUIT
TJA1041AU/V,025	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
TJA1028T/5V0/20	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
UJA1078ATW/5V0	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					14 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified				11 mm
TJA1054T/N,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
MC33FS4505LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1041AT/M,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
MC33FS4506NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1054T/S900,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8.65 mm
UJA1078TW/5V0,512	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	.099 mA		4.5/28	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.3	Network Interfaces	.635 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G32				Not Qualified
MC33FS6512CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
UJA1069TW24/3V0,51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	6.1 mm	Not Qualified				11 mm
TJA1050TD-T	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1046VTK	NXP Semiconductors	INTERFACE CIRCUIT
TJA1054AT/S900/VM	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
MC33662BSEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e3	40	260	4.9 mm
TJA1044VTK/3	NXP Semiconductors	INTERFACE CIRCUIT
MC33662LEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
UJA1076TW/3V3	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					14 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified				11 mm
MC33388D	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.005 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.125 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4	30	220	8.65 mm
TJA1041AU/V,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
UJA1061TW/3V0	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G32		1.1 mm	6.1 mm	Not Qualified	e3			11 mm
UJA1078TW/5V0/WD,1	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	.099 mA		4.5/28	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.3	Network Interfaces	.635 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G32				Not Qualified
TJA1054T/N1,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm				DUAL	.125 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8.65 mm
TJA1080ATS/1	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
TJA1041T/N1M,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
MC33FS6516NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
UJA1069TW/3VO/C;51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32		1.1 mm	6.1 mm					11 mm
UJA1169ATK/X	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
TJA1028T/3V3/10/2Z	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER																									1						260
TJA1054AT/S400/VM	NXP Semiconductors
NTS0101GS,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.35 mm	1 mm		e3	30	260	1 mm
TJA1463ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	4.5 mm					3 mm
MC33FS6520CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100											TIN				3				e3	40	260
MC33FS6523NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.