Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
88E1512-XX-NNP2I000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER							QUAD		S-XQCC-N56							NOT SPECIFIED	NOT SPECIFIED
ADM3057EBRWZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G20	3	2.65 mm	7.5 mm					260	12.8 mm
TJA1055T/CM,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.021 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	8.65 mm
TJA1029TK/20/1J	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	1	1 mm	3 mm			e4	30	260	3 mm
ADM3052BRWZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		DMOS		1		3.3 V	3.3/5	SMALL OUTLINE	SOP16,.4	Network Interfaces	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G16	3	2.65 mm	7.5 mm	Not Qualified		e3	30	260	10.3 mm
ISOW1044BDFMR	Texas Instruments	CAN FD TRANSCEIVER		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	211 mA	5 V		SMALL OUTLINE	SOP20,.4		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G20	3	3.55 mm	7.5 mm			e4		260	12.83 mm
TCAN330GDR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
TJA1050T/V,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
DP83826IRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1	53 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
KSZ8081RNBCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
KSZ9021RL	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
MCP2003B-E/SN	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e3	40	260	4.9 mm
SN65HVD1050DG4	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	NOT SPECIFIED	260	4.9 mm
KSZ8081RNBCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
TJA1145TK/FDJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100	1	1.5 mA		4.5/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		e4	30	260
MCP2551-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	75 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
ISOW1044DFMR	Texas Instruments	CAN FD TRANSCEIVER		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	136 mA	5 V		SMALL OUTLINE	SOP20,.4		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G20	3	3.55 mm	7.5 mm			e4		260	12.83 mm
MAX13054ASA	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
MAX13054ASA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
TJA1028TK/3V3/20/J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			e1	30	260	12 mm
ADIN1300CCPZ	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm			e3	30	260	6 mm
CR95HF-VMD5T	STMicroelectronics	ETHERNET TRANSCEIVER	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.0006 mA	3.3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
MCP2562-E/P	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949	1	70 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDIP-T8		5.334 mm	7.62 mm			e3			9.271 mm
NCV7342D10R2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8	2	1.7272 mm	3.937 mm	Not Qualified		e3	30	260	4.9276 mm
NTS0104BQ,115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N14	1	1 mm	2.5 mm				30	260	3 mm
NCN5130MNTWG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm			e3	30	260	6 mm
TCAN1043HGDQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	5 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm			e4	NOT SPECIFIED	NOT SPECIFIED	8.65 mm
MCP2561-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
SN65HVD232QD	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.017 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	NOT SPECIFIED	260	4.9 mm
TLE7268SKXUMA1	Infineon Technologies	INTERFACE CIRCUIT																						TIN				3					e3
88E1510-A0-NNB2C000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER						Tin (Sn)	QUAD		S-XQCC-N48						e3
TJA1101BHN/0Z	NXP Semiconductors	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		60 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm			e4		260	6 mm
MAX33041EASA+T	Analog Devices	CAN TRANSCEIVER																						Matte Tin (Sn) - annealed				1					e3	30	260
DP83849IFVS/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2		3.3 V	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
KSZ9021RLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
IFX1050GVIOXUMA1	Infineon Technologies	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.07 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G8	3	1.75 mm	4 mm			e3		260	5 mm
TCAN337GDR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
TCAN1042HGVDRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
88E1512PB2-NNP2C000	Marvell Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	8 mm		Also require supply 3.3V				8 mm
PTCAN4550RGYQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1				CHIP CARRIER			.5 mm	125 Cel	-40 Cel		QUAD	5 Mbps	R-PQCC-N20		1 mm	3.5 mm						4.5 mm
TCAN4550RGYQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100					CHIP CARRIER			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N20		1 mm	3.5 mm						4.5 mm
SN65HVD231QDR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.017 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
TJA1044GTK/3	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm		ESD on pins CANH and CANL ESD is 8kV		NOT SPECIFIED	NOT SPECIFIED	3 mm
TCAN1051HVDR	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	180 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm			e4	30	260	4.905 mm
TCAN332GDR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
TLE72593GEXUMA3	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL		R-PDSO-G8	2A	1.73 mm	3.94 mm			e3			4.93 mm
MCP2542FDT-E/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3	30	260	4.9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.