Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AR8035-AL1B-R	Qualcomm	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1	113.7 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N48		.8 mm	5 mm					5 mm
TJA1055T/C,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4	30	260	8.65 mm
KSZ8081MLXCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm		e3			7 mm
KSZ9131RNXV-TRVAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm		e3	30	260	7 mm
RN2483A-I/RM104	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47		3.367 mm	17.78 mm			NOT SPECIFIED	NOT SPECIFIED	26.67 mm
KSZ8061RNBW	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm		e3			5 mm
LAN8740AI-EN	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N32		1 mm	5 mm		e3			5 mm
TJA1050T/N1,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	40	260	4.9 mm
ISO1042DWV	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	2.8 mm	5.85 mm		e4	30	260	7.5 mm
MCP2551T-I/SNG	Microchip Technology	CAN TRANSCEIVER	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	75 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3		260	4.9 mm
MCP2562FDT-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
ADM3054BRWZ-RL7	Analog Devices	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		DMOS		1	.075 mA	3.3 V	3.3/5,5	SMALL OUTLINE	SOP16,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G16	3	2.65 mm	7.5 mm	Not Qualified	e3	30	260	10.3 mm
MCP2551-E/P	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949	1	75 mA	5 V	5	IN-LINE	DIP8,.3	Network Interfaces	2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDIP-T8		5.334 mm	7.62 mm	Not Qualified	e3			9.271 mm
SN65HVD231D	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.017 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	NOT SPECIFIED	260	4.9 mm
PCA82C251T/N3,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1		5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
MAX3051ESA-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1	.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3051ESA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1	.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
LTC2875HS8#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS				3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.899 mm		e3	30	260	4.9025 mm
NCV7351D13R2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8	2	1.727 mm	3.937 mm	Not Qualified	e3	30	260	4.927 mm
TLK110PTR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified	e4	30	260	7 mm
MCP251863T-H/SSVAO	Microchip Technology	CAN FD TRANSCEIVER
MCP2551T-I/SNVAO	Microchip Technology	CAN TRANSCEIVER	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	75 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
ISO1044BD	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	70 mA	1.8 V		SMALL OUTLINE	SOP8,.24		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm	3.895 mm		e4	30	260	4.905 mm
RTL8211FI-CG	Realtek Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.9 mm	5 mm					5 mm
AD9371BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
TJA1057GTK/3Z	NXP Semiconductors	INTERFACE CIRCUIT																										1						260
KSZ8091RNAIA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24	2	.9 mm	4 mm		e3	30	260	4 mm
TLE6250GV33NT	Infineon Technologies	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS				3.3 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	4 mm					5 mm
TCAN4550RGYTQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	8 Mbps	R-PQCC-N20	2	1 mm	3.5 mm		e3	30	260	4.5 mm
TJA1028TK/5V0/20/J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-N8	1	1 mm	3 mm		e4	30	260	3 mm
TCAN332DCNR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm		e4	30	260	2.9 mm
PCA82C251T/N3	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	78 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1027TK/20/1J	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
SN65HVD251D	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	NOT SPECIFIED	260	4.9 mm
DP83822HFRHBT	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N32	2	1 mm	5 mm		e4	30	260	5 mm
PCA82C251T/N3,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1		5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
KSZ9131RNXV-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm		e3	30	260	7 mm
DP83822HFRHBR	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N32	2	1 mm	5 mm		e4	30	260	5 mm
ADIN1300BCPZ-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	.8 mm	6 mm		e3	30	260	6 mm
AR8035-AL1A	Qualcomm	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1	113.7 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.8 mm	5 mm					5 mm
88E1111-B2-BAB1C000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		1		1 V		GRID ARRAY, LOW PROFILE			1 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B117		1.54 mm	10 mm		e1			14 mm
TCAN332DR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MCP2562FD-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
TLE6250GV33NTMA1	Infineon Technologies	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS				3.3 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
TCAN332DCNT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm		e4	30	260	2.9 mm
NCN5121MNTWG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm		e3	30	260	6 mm
SN65HVD251DG4	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	NOT SPECIFIED	260	4.9 mm
PCA82C251TD	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	78 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4	40	260	4.9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.