10 Other Function Telecom Interface ICs 161

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGSA14GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm						1.5 mm
TDA7116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
USB3740B-AI9-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		5 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-PQCC-N10		.6 mm	1.6 mm			e4			2.1 mm
USB3740B-AI9TR	Standard Microsystems	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N10		.6 mm	1.6 mm				NOT SPECIFIED	NOT SPECIFIED	2.1 mm
TDK5101FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5100FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDA5150	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V	2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.05 mm	3 mm	Not Qualified				260	3 mm
ATA8405C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	50 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm	3 mm			e3	40	260	3 mm
TDA7110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
BGS12PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBCC-N10	1	.4 mm	1.1 mm						1.5 mm
ATA8404C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	50 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm	3 mm			e3	40	260	3 mm
SI4010-C2-GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified					3 mm
BGS14PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N10	1	.4 mm	1.1 mm						1.5 mm
TDA7100HTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	-20 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
BGSA12GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm						1.5 mm
PE64904MLBB-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.6 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.08SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-XQCC-N10	1	.5 mm	2 mm			e4	30	260	2 mm
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			2.85 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm			e3			1.5 mm
BGSA11GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm						1.5 mm
BGSA13GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-N10	1	.4 mm	1.1 mm						1.5 mm
SY88403BLEY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G10		1.1 mm	3 mm	Not Qualified		e3			3 mm
TDA7116F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified				260	3 mm
TDA7116FXT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
ONET4291TAY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				25 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	4250 Mbps	R-XUUC-N10				Not Qualified	Data rate is 4.25 Gbps		NOT SPECIFIED	NOT SPECIFIED
PE64904C-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.6 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.08SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N10	1	.5 mm	2 mm			e4	10	260	2 mm
NJG1157PCD-TE1	New Japan Radio	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DMA	SQUARE	UNSPECIFIED	YES	1					1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	105 Cel	-40 Cel		DUAL		S-XDMA-N10		.63 mm	2.5 mm		HEAT SINK AVAILABLE				2.5 mm
SI4010-C2-GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G10	2	1.1 mm	3 mm	Not Qualified		e4	40	260	3 mm
ATA5749C-6DQY	Atmel	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm						3 mm
ATA5749C-6DQY-64	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.04 Mbps	S-PDSO-G10	2	1.1 mm	3 mm			e3	40	260	3 mm
SI4012-C1001GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
IA3222B-F-FTR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	10	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.508 mm	85 Cel	-25 Cel		DUAL		S-PDSO-G10		.9652 mm	3.048 mm				NOT SPECIFIED	NOT SPECIFIED	3.048 mm
SI4010-C2-ATR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4012-C1001GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
AWT6652Q7	Ii-vi	TELECOM CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.4 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm				DUAL		S-PDSO-N10	3	1 mm	3 mm						3 mm
LMV242LDX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		.015 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0	20	235	3 mm
LMV242LD/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	2	BIPOLAR		.015 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N10	3	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
SN56514L	Texas Instruments		MILITARY	WIRE	10		ROUND	METAL				BIPOLAR				12,-8	CYLINDRICAL	CAN10,.23	Other Telecom ICs		125 Cel	-55 Cel		BOTTOM		O-MBCY-W10				Not Qualified
LMV242LD	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		.015 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0	20	235	3 mm
ONET2511TAY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				.035 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	2500 Mbps	R-XUUC-N10				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LMV242LDX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		.015 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N10	3	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
ONET4291TY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				25 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	4250 Mbps	R-XUUC-N10				Not Qualified	Data rate is 4.25 Gbps		NOT SPECIFIED	NOT SPECIFIED
ONET4291TAYS	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				.025 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N10				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LMV242MDA	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1		BIPOLAR			2.6 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N10	1			Not Qualified
LTC1957-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4402-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4403-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC1757A-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4402-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.