10 Other Function Telecom Interface ICs 161

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC1957-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4403-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3658AE/D	Analog Devices	TELECOM CIRCUIT		NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP						TIN LEAD	UPPER	R-XUUC-N10				Not Qualified		e0
MAX3658BE/D	Analog Devices	TELECOM CIRCUIT		NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP						TIN LEAD	UPPER	R-XUUC-N10				Not Qualified		e0
LTC1758-2EMS#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1957-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
LTC1757-2CMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	70 Cel	0 Cel		DUAL	S-PDSO-G10	1	1.17 mm	3 mm		SEATED HT-CALCULATED			245	3 mm
LTC4403-2EMS#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1757A-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.17 mm	3 mm	Not Qualified		e0			3 mm
LTC1758-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4403-2EMS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1757-2EMS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G10				Not Qualified		e0
LTC4402-2EMS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1757A-2EMS#TR	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1758-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC1957-2EMS#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1758-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1757A-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4402-2EMS#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
AD8015ACHIPS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1			26 mA	5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N10				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
AD8316ARM-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified		e0			3 mm
AD8316ARM	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified		e0			3 mm
AD8316ARM-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified		e0			3 mm
MAX2670GTB/V+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX2670GTB+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX2670GTB/V+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	2				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX2670GTB+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	2				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX2670GTB+TW	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		DUAL	S-PDSO-N10		.8 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
LV2256PTT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm						3 mm
NLAS7242MUTBG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.6 mm	1.4 mm			e4	30	260	1.8 mm
TCP-3039N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B10		.611 mm	.722 mm						1.029 mm
TCP-3033N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B10		.611 mm	.722 mm						1.029 mm
LV2257PTT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm						3 mm
TCP-3039H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B10		.611 mm	.722 mm						1.029 mm
LS025T	STMicroelectronics		OTHER	WIRE	10		ROUND	METAL			BIPOLAR		2.5 mA		-12/-30	CYLINDRICAL	CAN10,.23	Other Telecom ICs		85 Cel	-25 Cel		BOTTOM	O-MBCY-W10				Not Qualified
PCF5079T/C/1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	3.6 V	2.5/5	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10				Not Qualified		e4
PCF5079HK/C/1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	3.6 V	2.5/5	SMALL OUTLINE	SOLCC10,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N10				Not Qualified
S042E	Infineon Technologies		COMMERCIAL	WIRE	10		ROUND	METAL			BIPOLAR		2.9 mA	12 V	12	CYLINDRICAL	CAN10,.23	Other Telecom ICs		70 Cel	-15 Cel	Tin/Lead (Sn/Pb)	BOTTOM	O-MBCY-W10				Not Qualified		e0
BGAU1A10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B10	1	.65 mm	1.1 mm						1.5 mm
TDK5110FXT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TDK5110F	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified					3 mm
TDK5111FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5111F	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
TDK5100FXT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TDK5100F	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified				260	3 mm
SP000300415	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G10		1.05 mm	3 mm						3 mm
TDK5101FTDA52	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm						3 mm
TDK5116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.