100 Other Function Telecom Interface ICs 167

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCD5094H	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
PCD5093H-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
TDA8044AH/C2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
PCD5095H-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
SAA1575	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified				14 mm
SAA1575-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified				14 mm
935262794518	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
TDA8044H/C2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
MC71000	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100		1.35 mm			7 mm					7 mm
TDA8044H	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
935262794557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	20 mm
PR601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm					14 mm
TDA8044AHBA	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
PCD5093H	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
P51XASCCB	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD	S-PQFP-G100						Not Qualified
PCD5094H-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified				20 mm
TDA8044AH	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel	Tin (Sn)	QUAD	R-PQFP-G100		3.2 mm			14 mm	Not Qualified	e3			20 mm
PRH601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm					14 mm
SAA1575HL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e3			14 mm
PSB7110FV1.0	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.6 V	3.6,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
PMB2727-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.4 mm			14 mm	Not Qualified				20 mm
PSB7110FV1.1	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			3.6,5	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100						Not Qualified	e0
PEB20571	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.275 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified				14 mm
PSB7110FV1.2	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			3.6,5	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100						Not Qualified	e0
DELIC-PB	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS	275 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100						Not Qualified	e0
DELIC-LC	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS	275 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100						Not Qualified	e0
PMB2707-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified				14 mm
PEB22521F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified				14 mm
PEB20570	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.275 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified				14 mm
PEB3554	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.4 mm			14 mm	Not Qualified				20 mm
PSB7280-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK							QUAD	S-PQFP-G100						Not Qualified
PMB2728-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.4 mm			14 mm	Not Qualified				20 mm
MAX2101	Maxim Integrated		COMMERCIAL	GULL WING	100	QFP		METAL	YES		BIPOLAR		5 V	5	FLATPACK	QFP100(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							Not Qualified	e0
TC35191F	Toshiba	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD	R-PQFP-G100						Not Qualified		NOT SPECIFIED	240
TB6865AFG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100		1.7 mm			14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
82V3285DQ8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3						e0	20	240
82V3380DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.4 mm			14 mm	Not Qualified	e0	20	240	14 mm
IDT82V3280DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0	20	240	14 mm
82V3380EQG8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3					Not Qualified	e3	30	260
82V3285AEQG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
82V3385PF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0	20	240	14 mm
82V3385PFGI8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3					Not Qualified	e3	30	260
82V3280PFG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm		e3	30	260	14 mm
82V3285EQG8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3					Not Qualified	e3	30	260
82V3280DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0	20	240	14 mm
82V3285EQG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
82P2282PK	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES					1.8,3.3	FLATPACK	QFP100,.63X.87	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G100	3		T-1(DS1)	CEPT PCM-30/E-1		Not Qualified	e0	20	225
82V3285DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.4 mm			14 mm	Not Qualified	e0	20	240	14 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.