100 Other Function Telecom Interface ICs 167

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
82V3285PFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
82V3280EQG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN	DUAL	S-PDSO-G100	3	1.6 mm	14 mm		e3		260	14 mm
IDT82V3280PF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e0	20	240	14 mm
HSP50415VIZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.5 mA	3.3 V	3.3	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G100	3	3.4 mm	14 mm	Not Qualified	e3			20 mm
IDT82V3280PFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
82V3390BEQG8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			345 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3			Not Qualified	e3	30	260
82V3385PF8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3			Not Qualified	e0	20	240
82V3391BEQG	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G100	3			Not Qualified	e3		260
82V3285PF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e0	20	240	14 mm
HSP50415VI	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.5 mA	3.3 V	3.3	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G100	4	3.4 mm	14 mm	Not Qualified	e0			20 mm
82V3385PFGI	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3			Not Qualified	e3	30	260
82V3380EQG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm		e3	30	260	14 mm
IDT82V3380DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.4 mm	14 mm	Not Qualified	e0			14 mm
TW3801-TC1-CR	Renesas Electronics	TELECOM CIRCUIT		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		FLATPACK							QUAD	S-PQFP-G100						NOT SPECIFIED	NOT SPECIFIED
82V3285DQG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G100	3				e3	30	260
BCM6010	Broadcom	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.4 mm	14 mm	Not Qualified				20 mm
BCM3116	Broadcom	TELECOM CIRCUIT		GULL WING	100	QFP		PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK							QUAD	X-PQFP-G100	1			Not Qualified
BCM3118B	Broadcom	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK			.65 mm				QUAD	R-PQFP-G100	1	3.4 mm	14 mm	Not Qualified				20 mm
T8301	Broadcom	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified	e0	30	240	14 mm
L64724QC	Broadcom		COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES				3.3 V	3.3	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.635 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100				Not Qualified
L64767WE	Broadcom		OTHER	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES				5 V	5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.635 mm	85 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQFP-G100				Not Qualified	e0
BCM5754	Broadcom	TELECOM CIRCUIT		BALL	100	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM	X-PBGA-B100
BCM3137	Broadcom	TELECOM CIRCUIT		GULL WING	100	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD	X-PQFP-G100	1			Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.