11 Other Function Telecom Interface ICs 19

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SPSGRF-868	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
BLUENRG-M0A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.5 mm	11.5 mm				20	240	13.5 mm
BLUENRG-M0L	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.5 mm	11.5 mm				20	240	13.5 mm
SPSGRF-915	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SPBTLE-RF	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SI3462-E01-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm						3 mm
SI3462-E01-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm						3 mm
HPA00506AY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1		20 mA	3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	2500 Mbps	R-XUUC-N11					Data rate is 2.5 Gbps		NOT SPECIFIED	NOT SPECIFIED
ONET2591TAYS	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1		.023 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N11				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
ONET2591TAY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1		20 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	2500 Mbps	R-XUUC-N11				Not Qualified	Data rate is 2.5 Gbps		NOT SPECIFIED	NOT SPECIFIED
BGM681L11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	11	DIE	SQUARE	UNSPECIFIED	YES	1			2.8 V		UNCASED CHIP							UPPER		S-XUUC-N11		.65 mm	2.5 mm						2.5 mm
BGM781N11E6327XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel		DUAL		S-PDSO-N11		.77 mm	2.5 mm						2.5 mm
BGM781N11	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-N11	1	.77 mm	2.5 mm	Not Qualified				225	2.5 mm
BGM781N11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel		DUAL		S-PDSO-N11		.77 mm	2.5 mm				NOT SPECIFIED	NOT SPECIFIED	2.5 mm
BGM681L11	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	11	DIE	SQUARE	UNSPECIFIED	YES	1			2.8 V		UNCASED CHIP							UPPER		S-XUUC-N11				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
IP4365CX11/P	Nexperia	TELECOM CIRCUIT	OTHER	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-35 Cel		BOTTOM		R-PBGA-B11		.65 mm	1.16 mm						1.56 mm
MAX3793E/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.046 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	UPPER		R-XUUC-N11				Not Qualified		e0
MAX3657BE/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER		R-XUUC-N11				Not Qualified		e0
MAX3657E/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER		R-XUUC-N11				Not Qualified		e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.