12 Other Function Telecom Interface ICs 93

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

MRF24J40MA-I/RM

Microchip Technology

INDUSTRIAL

12

PLASTIC/EPOXY

3.3 V

3.3

MICROELECTRONIC ASSEMBLY

MODULE,12LEAD,.7

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

TUSB211IRWBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.02 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

L86-M33

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

S-XDMA-N12

7.15 mm

18.4 mm

260

18.4 mm

MRF24J40MD-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDMA-N12

3.3528 mm

22.86 mm

e3

33.02 mm

MRF24J40MAT-I/RM

Microchip Technology

INDUSTRIAL

12

PLASTIC/EPOXY

3.3 V

3.3

MICROELECTRONIC ASSEMBLY

MODULE,12LEAD,.7

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

L80-M39

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

S-XDMA-N12

7.05 mm

16 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

MRF24J40ME-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N12

3.48 mm

22.86 mm

33.02 mm

TUSB211RWBR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.02 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

HMC773ALC3BTR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N12

3

.92 mm

3 mm

e4

3 mm

BGM15MA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

1.9 mm

BGM15LA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

e4

1.9 mm

SX8651IWLTRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.45 mm

85 Cel

-40 Cel

TIN

DUAL

S-PDSO-N12

2

.8 mm

3 mm

e3

260

3 mm

MRF24J40MDT-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDMA-N12

3.3528 mm

22.86 mm

e3

33.02 mm

BGM15HA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

e4

1.9 mm

HMC773ALC3BTR-R5

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N12

.9 mm

2.9 mm

NOT SPECIFIED

NOT SPECIFIED

2.9 mm

SX8651ICSTRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBGA-B12

1

.625 mm

1.5 mm

e4

260

2 mm

HMC773ALC3B

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TUNGSTEN NICKEL GOLD

QUAD

S-CQCC-N12

3

.92 mm

3 mm

260

3 mm

PE42426A-Z

Psemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N12

1

.8 mm

3 mm

e4

30

260

3 mm

TUSB211QRWBRQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.02 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

MRF24J40MB-I/RM

Microchip Technology

INDUSTRIAL

12

PLASTIC/EPOXY

2.5/3.3

MODULE,12LEAD,.9

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

LTC5587IDD#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.45 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MRF24J40MET-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N12

3.48 mm

22.86 mm

33.02 mm

LTC5587IDD#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.45 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

SE2433T-R

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG

QUAD12,.09 X.07

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N12

1

.6 mm

2 mm

260

2.5 mm

AN7580

Panasonic

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

12

SIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

12 V

IN-LINE

75 Cel

-25 Cel

SINGLE

R-PSIP-T12

Not Qualified

PE613050A-Z

Psemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.75 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N12

1

.55 mm

2 mm

e4

30

260

2 mm

LM3291TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

ISO150AUG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G12

3

2.65 mm

7.5 mm

Not Qualified

e4

30

260

17.9 mm

LM3291TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

ISO150AP

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

12

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

2

BICMOS

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T12

5.33 mm

7.62 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

29.905 mm

ISO150AU/1K

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G12

3

2.65 mm

7.5 mm

Not Qualified

e4

30

260

17.9 mm

ISO150AU

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G12

3

2.65 mm

7.5 mm

Not Qualified

e4

30

260

17.9 mm

ISO150AUE4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G12

3

2.65 mm

7.5 mm

Not Qualified

e4

30

260

17.9 mm

ISO150AU/1KG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G12

3

2.65 mm

7.5 mm

Not Qualified

e4

30

260

17.9 mm

TUSB214QRWBTQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB214RWBR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

4 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB211RWBT

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

QUAD

S-PQCC-N12

.4 mm

1.6 mm

1.6 mm

TUSB212IRWBT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB212RWBR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB214QRWBRQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB211IRWBT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N12

.4 mm

1.6 mm

1.6 mm

TUSB212QRWBTQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB212RWBT

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB214IRWBT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB212QRWBRQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB214IRWBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB212IRWBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

TUSB214RWBT

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.03 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.