12 Other Function Telecom Interface ICs 93

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

HMC773LC3B

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N12

3

.92 mm

3 mm

Not Qualified

e4

260

3 mm

MAX3657EGG

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N12

.9 mm

3 mm

Not Qualified

e0

3 mm

HMC773LC3BTR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N12

3

.92 mm

3 mm

Not Qualified

e4

260

3 mm

HMC554LC3B

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-XQCC-N12

3

.92 mm

3 mm

Not Qualified

e4

30

260

3 mm

HMC554LC3BTR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N12

1

.92 mm

3 mm

e4

3 mm

TCP-3082N-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3068N-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3156H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.15 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.32 mm

.652 mm

NOT SPECIFIED

NOT SPECIFIED

1.134 mm

LC898212XC-MH

Onsemi

TELECOM CIRCUIT

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.37 mm

e1

30

260

1.77 mm

TCP-3047N-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3047H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3082H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3056H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

LC898212XD-SH

Onsemi

TELECOM CIRCUIT

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.37 mm

e1

30

260

1.77 mm

TCP-3056N-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3068H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

STHVDAC-253C7

STMicroelectronics

TELECOM CIRCUIT

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,14

.35 mm

85 Cel

-30 Cel

BOTTOM

R-XBGA-B12

.64 mm

1.1 mm

NOT SPECIFIED

NOT SPECIFIED

1.45 mm

BGSX44MA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B12

1

.65 mm

1.6 mm

1.6 mm

ICE5AR4770AG

Infineon Technologies

TELECOM CIRCUIT

GULL WING

12

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

18 V

SMALL OUTLINE

SOP12,.25

1.27 mm

150 Cel

-40 Cel

DUAL

R-PDSO-G12

3

1.75 mm

3.9 mm

9.9 mm

BGM15HA12E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N12

.65 mm

1.1 mm

1.9 mm

BGM15LA12E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B12

.65 mm

1.1 mm

1.9 mm

BGS15M2A12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

1.9 mm

BGM15MA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N12

1

.65 mm

1.1 mm

1.9 mm

BGS15M2A12

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

1.9 mm

BGM15LA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

e4

1.9 mm

BGS15MA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

QUAD

R-XQCC-N12

1

.65 mm

1.1 mm

1.9 mm

BGS15MA12

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

QUAD

R-XQCC-N12

1

.65 mm

1.1 mm

1.9 mm

BGM15HA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N12

1

.65 mm

1.1 mm

1.9 mm

BGM15MA12E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N12

.65 mm

1.1 mm

NOT SPECIFIED

NOT SPECIFIED

1.9 mm

MAX3657ETC+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N12

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3657ETC+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N12

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3657ETC-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.034 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC12,.12SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N12

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3657ETC

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.034 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC12,.12SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N12

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

DRT1-2312

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

ALM-GP001-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N12

3

1.1 mm

2.5 mm

260

3 mm

DRT1-2311

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

HDMP-2003

Broadcom

TELECOM CIRCUIT

MILITARY

GULL WING

12

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

-5.2 V

FLATPACK

2.54 mm

125 Cel

-55 Cel

QUAD

S-PQFP-G12

3.6 mm

12.7 mm

Not Qualified

12.7 mm

ALM-GP002-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N12

1.05 mm

2.2 mm

4.5 mm

ALM-GP002-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N12

3

1.05 mm

2.2 mm

260

4.5 mm

DRT1-3813

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

HDMP-2004

Broadcom

TELECOM CIRCUIT

MILITARY

GULL WING

12

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

-5.2 V

FLATPACK

2.54 mm

125 Cel

-55 Cel

QUAD

S-PQFP-G12

3.6 mm

12.7 mm

Not Qualified

12.7 mm

ALM-GP001-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N12

1.1 mm

2.5 mm

3 mm

DRT1-2322

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

DRT1-3823

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

DRT1-2321

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.