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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | STHVDAC-253C7 |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.3 V; |
| Datasheet | STHVDAC-253C7 Datasheet |
| In Stock | 3,345 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
497-18350-6 497-18350-2 497-18350-1 |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .64 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 12 |
| Package Equivalence Code: | BGA12,3X4,14 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 1.45 mm |
| JESD-30 Code: | R-XBGA-B12 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | VFBGA |
| Width: | 1.1 mm |
| Terminal Pitch: | .35 mm |
