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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | STHVDAC-253C7 |
Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.3 V; |
Datasheet | STHVDAC-253C7 Datasheet |
In Stock | 3,345 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | .64 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -30 Cel |
No. of Functions: | 1 |
No. of Terminals: | 12 |
Package Equivalence Code: | BGA12,3X4,14 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Length: | 1.45 mm |
JESD-30 Code: | R-XBGA-B12 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Package Code: | VFBGA |
Width: | 1.1 mm |
Terminal Pitch: | .35 mm |