Infineon Technologies - BGS15M2A12E6327XTSA1

BGS15M2A12E6327XTSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGS15M2A12E6327XTSA1
Description TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet BGS15M2A12E6327XTSA1 Datasheet
In Stock21
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .65 mm
Surface Mount: YES
Minimum Operating Temperature: -30 Cel
No. of Functions: 1
No. of Terminals: 12
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
Length: 1.9 mm
Technology: MOS
JESD-30 Code: R-XBCC-B12
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: BCC
Width: 1.1 mm
Terminal Pitch: .4 mm
Temperature Grade: OTHER
Moisture Sensitivity Level (MSL): 1
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