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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | BGS15M2A12E6327XTSA1 |
Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR; |
Datasheet | BGS15M2A12E6327XTSA1 Datasheet |
In Stock | 21 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | .65 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -30 Cel |
No. of Functions: | 1 |
No. of Terminals: | 12 |
Terminal Position: | BOTTOM |
Package Style (Meter): | CHIP CARRIER |
Length: | 1.9 mm |
Technology: | MOS |
JESD-30 Code: | R-XBCC-B12 |
Package Shape: | RECTANGULAR |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BCC |
Width: | 1.1 mm |
Terminal Pitch: | .4 mm |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 1 |