Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
4 mm |
Not Qualified |
e4 |
30 |
260 |
8.75 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
4 mm |
Not Qualified |
e4 |
30 |
260 |
8.75 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
8.65 mm |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
.016 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
5 V |
3 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
RFID Card Reader |
e4 |
30 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
5 V |
3 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
.016 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
.016 mA |
5 V |
3/5 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T14 |
5.334 mm |
7.62 mm |
Not Qualified |
e3 |
19.05 mm |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
14 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
QUAD |
S-XQMA-B14 |
1 |
.65 mm |
2 mm |
2 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
2 mm |
3.9 mm |
Not Qualified |
40 |
260 |
8.65 mm |
|||||||||||||||||||||||||||||||||||||||
|
Exar |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.009 mA |
12 V |
12 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
8.65 mm |
||||||||||||||||||||||||||||||||||
|
Exar |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
12 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
8.65 mm |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBCC-N14 |
1 |
.65 mm |
2 mm |
2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
3 |
2 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
14 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
GOLD NICKEL |
QUAD |
S-XQMA-B14 |
1 |
.65 mm |
2 mm |
e4 |
2 mm |
||||||||||||||||||||||||||||||||||||||||||
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HTSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
85 Cel |
-40 Cel |
DUAL |
S-XDSO-N14 |
1.05 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HTSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
85 Cel |
-40 Cel |
DUAL |
S-XDSO-N14 |
1.05 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
14 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
GOLD NICKEL |
QUAD |
S-XQMA-B14 |
1 |
.65 mm |
2 mm |
e4 |
2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
LSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4.5 V |
SMALL OUTLINE, LOW PROFILE |
1.06 mm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
DUAL |
S-PDSO-N14 |
3 |
1.4 mm |
7 mm |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
14 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-40 Cel |
GOLD NICKEL |
BOTTOM |
S-XBCC-B14 |
1 |
.65 mm |
2 mm |
e4 |
2 mm |
|||||||||||||||||||||||||||||||||||||||
|
Qorvo |
TELECOM CIRCUIT |
NO LEAD |
14 |
HQCCN |
SQUARE |
YES |
1 |
40 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC14,.2SQ,20 |
.5 mm |
Nickel/Gold (Ni/Au) |
QUAD |
S-XQCC-N14 |
3 |
1.64 mm |
4 mm |
SEATED HEIGHT NOMINAL |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||||||||||||||||||||||||||||||||
Exar |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
9 mA |
12 V |
12 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
30 |
215 |
8.65 mm |
|||||||||||||||||||||||||||||||||
|
Exar |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
.009 mA |
12 V |
12 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T14 |
5.33 mm |
7.62 mm |
Not Qualified |
e3 |
19.305 mm |
|||||||||||||||||||||||||||||||||||
Intersil |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
1.5 mA |
5 V |
5 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T14 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Fairchild Semiconductor |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
12,-8 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T14 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
5 mm |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.753 mm |
3.899 mm |
8.62 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.848 Mbps |
R-PDSO-G14 |
2 |
1.2 mm |
4.4 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
3.3 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T14 |
5.33 mm |
7.62 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
19.3 mm |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
8.65 mm |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G14 |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
5 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3.3 V |
SMALL OUTLINE |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-XDSO-G14 |
2 |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
12,-8 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T14 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
15 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T14 |
5.08 mm |
15.24 mm |
Not Qualified |
36.36 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.848 Mbps |
R-PDSO-G14 |
2 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
12,-8 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T14 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
12,-8 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T14 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
14 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-15 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
14 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-15 Cel |
UPPER |
R-XUUC-N14 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
Not Qualified |
5 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
e0 |
5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
260 |
5 mm |
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STMicroelectronics |
OTHER |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
120 mA |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T14 |
Not Qualified |
e0 |
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STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
20 V |
20 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
55 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T14 |
Not Qualified |
e0 |
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STMicroelectronics |
OTHER |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
2.5 mA |
-12/-30 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G14 |
Not Qualified |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.