14 Other Function Telecom Interface ICs 113

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

HTRC11001T/02EE,11

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

4 mm

Not Qualified

e4

30

260

8.75 mm

HTRC11001T/03EE,11

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

4 mm

Not Qualified

e4

30

260

8.75 mm

HTRC11001T/02EE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

8.65 mm

MCP2120-I/SL

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

.016 mA

5 V

3/5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

HTRC11001T/03EE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

3

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

RFID Card Reader

e4

30

260

8.65 mm

HTRC11001T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

3

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

Not Qualified

e4

MCP2120T-I/SL

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

.016 mA

5 V

3/5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

MCP2120-I/P

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

.016 mA

5 V

3/5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T14

5.334 mm

7.62 mm

Not Qualified

e3

19.05 mm

BGS18GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

SI4010-C2-GSR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

2 mm

3.9 mm

Not Qualified

40

260

8.65 mm

XR2211ACD-F

Exar

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.009 mA

12 V

12

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G14

2

1.75 mm

3.9 mm

Not Qualified

e3

8.65 mm

XR2211ACDTR-F

Exar

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

12 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G14

2

1.75 mm

3.9 mm

Not Qualified

e3

8.65 mm

BGS16GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-N14

1

.65 mm

2 mm

2 mm

SI4010-C2-GS

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

3

2 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

BGS14GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

GOLD NICKEL

QUAD

S-XQMA-B14

1

.65 mm

2 mm

e4

2 mm

RFPA5201ESR

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

HTSON

SQUARE

UNSPECIFIED

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

85 Cel

-40 Cel

DUAL

S-XDSO-N14

1.05 mm

7 mm

7 mm

RFPA5201ETR13

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

HTSON

SQUARE

UNSPECIFIED

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

85 Cel

-40 Cel

DUAL

S-XDSO-N14

1.05 mm

7 mm

7 mm

BGS15GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

GOLD NICKEL

QUAD

S-XQMA-B14

1

.65 mm

2 mm

e4

2 mm

TQP9221

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

LSON

SQUARE

PLASTIC/EPOXY

YES

1

4.5 V

SMALL OUTLINE, LOW PROFILE

1.06 mm

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

DUAL

S-PDSO-N14

3

1.4 mm

7 mm

e4

NOT SPECIFIED

NOT SPECIFIED

7 mm

BGS13GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

S-XBCC-B14

1

.65 mm

2 mm

e4

2 mm

TGA2976-SM

Qorvo

TELECOM CIRCUIT

NO LEAD

14

HQCCN

SQUARE

YES

1

40 V

CHIP CARRIER, HEAT SINK/SLUG

LCC14,.2SQ,20

.5 mm

Nickel/Gold (Ni/Au)

QUAD

S-XQCC-N14

3

1.64 mm

4 mm

SEATED HEIGHT NOMINAL

e4

NOT SPECIFIED

NOT SPECIFIED

4 mm

XR-2211ACD

Exar

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

9 mA

12 V

12

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e0

30

215

8.65 mm

XR2211ACP-F

Exar

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

.009 mA

12 V

12

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDIP-T14

5.33 mm

7.62 mm

Not Qualified

e3

19.305 mm

HC1-55536-5

Intersil

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

CMOS

1.5 mA

5 V

5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T14

Not Qualified

e0

UA796PC

Fairchild Semiconductor

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

12,-8

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

RF430CL330HPW

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

5 mm

CLC012AJE

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.753 mm

3.899 mm

8.62 mm

RF430CL331HIPWR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

.848 Mbps

R-PDSO-G14

2

1.2 mm

4.4 mm

e4

30

260

5 mm

UCC5342N

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BICMOS

3.3 V

IN-LINE

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T14

5.33 mm

7.62 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

19.3 mm

UCC5342D

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

8.65 mm

RF430CL330HTB

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

70 Cel

0 Cel

DUAL

R-PDSO-G14

RF430CL331HIPW

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

5 mm

RF430CL330HTPWRQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3.3 V

SMALL OUTLINE

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-XDSO-G14

2

e4

30

260

SN56514J

Texas Instruments

MILITARY

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

12,-8

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

DUAL

R-XDIP-T14

Not Qualified

UCC2750N

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BICMOS

15 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T14

5.08 mm

15.24 mm

Not Qualified

36.36 mm

RF430CL330HCPWR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

.848 Mbps

R-PDSO-G14

2

1.2 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

SN76514N

Texas Instruments

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

12,-8

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T14

Not Qualified

SN76514J

Texas Instruments

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

12,-8

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

DUAL

R-XDIP-T14

Not Qualified

ADN2820

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

14

DIE

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-15 Cel

TIN LEAD

UPPER

R-XUUC-N14

Not Qualified

e0

ADN2820ACHIPS

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

14

DIE

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-15 Cel

UPPER

R-XUUC-N14

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MC33169DTB-4R2

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.8 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1

1.2 mm

4.4 mm

Not Qualified

e4

5 mm

MC33170DTBR2

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

Not Qualified

e4

260

5 mm

MC33169DTB-004

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.8 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

Not Qualified

5 mm

MC33169DTB-4.0

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.8 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

e0

5 mm

MC33170DTB

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1.2 mm

4.4 mm

Not Qualified

e4

260

5 mm

LS285AB1

STMicroelectronics

OTHER

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

120 mA

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

L3280B

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

20 V

20

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

55 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

LS025M

STMicroelectronics

OTHER

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

2.5 mA

-12/-30

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G14

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.