14 Other Function Telecom Interface ICs 113

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SPBT2532C2.AT

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N14

10.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

13.5 mm

SA5211D,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.031 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

SA5211D-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

SA5211D/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

SA5211D,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

935260091112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

4 mm

Not Qualified

e4

8.75 mm

SA5211D/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

SA5211D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

935260092118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

4 mm

Not Qualified

e4

8.75 mm

PTGA090304MD

Infineon Technologies

TELECOM CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G14

2.62 mm

9.02 mm

14.94 mm

PEB2023T

Infineon Technologies

TELECOM CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G14

Not Qualified

S042P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

2.9 mA

12 V

12

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

-15 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

PEF2023T

Infineon Technologies

TELECOM CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

DUAL

R-PDSO-G14

Not Qualified

PEB2023

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

40 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G14

1.75 mm

4 mm

Not Qualified

8.75 mm

PEF2023

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

40 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G14

1.75 mm

4 mm

Not Qualified

e0

8.75 mm

TLE6255

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

4 mm

Not Qualified

8.75 mm

BGS13GA14E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

S-XBCC-B14

.65 mm

2 mm

e4

2 mm

BGS17GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

GOLD NICKEL

QUAD

S-XQMA-B14

1

.65 mm

2 mm

e4

2 mm

BGS16MN14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

Tin (Sn)

QUAD

S-PQCC-N14

1

.77 mm

2 mm

e3

NOT SPECIFIED

NOT SPECIFIED

2 mm

BGS15BN14

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

QUAD

S-XQCC-N14

.77 mm

1.6 mm

NOT SPECIFIED

NOT SPECIFIED

1.6 mm

BGS18GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS17GA14E6327

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

.65 mm

2 mm

2 mm

BGS15GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS13BN14

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

MATTE TIN

QUAD

S-XQCC-N14

.77 mm

1.6 mm

e3

1.6 mm

TDA5664

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

29 mA

5 V

5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

BGS18MN14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-PQCC-N14

1

.77 mm

2 mm

e3

2 mm

BGS14GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS16GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B14

1

.65 mm

2 mm

2 mm

BGS13GA14

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B14

1

.65 mm

2 mm

2 mm

BGS18MN14

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

Tin (Sn)

QUAD

S-PQCC-N14

1

.77 mm

2 mm

e3

NOT SPECIFIED

NOT SPECIFIED

2 mm

TDA5664-X

Infineon Technologies

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

29 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G14

Not Qualified

e0

BGS16MN14

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N14

1

.77 mm

2 mm

2 mm

BGS14BN14

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

MATTE TIN

QUAD

S-XQCC-N14

.77 mm

1.6 mm

e3

1.6 mm

BGS17GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

TA7657P

Toshiba

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

6/10

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

HC1-55536-7

Renesas Electronics

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

CMOS

1.5 mA

5 V

5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T14

e0

HC1-55564-7

Renesas Electronics

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

CMOS

5 V

5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

DUAL

R-XDIP-T14

263DN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

AFEM-S105-BLKG

Broadcom

TELECOM CIRCUIT

NO LEAD

14

HQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

QUAD

S-XQCC-N14

3

3.2 mm

260

3.2 mm

263FN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

263LN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

263EN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

263CN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

263GN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

263HN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

263MN

Broadcom

TELECOM CIRCUIT

COMMERCIAL

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

70 Cel

-20 Cel

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

AFEM-S106-BLKG

Broadcom

TELECOM CIRCUIT

OTHER

BUTT

14

HBCC

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-30 Cel

BOTTOM

S-XBCC-B14

3

3.2 mm

260

3.2 mm

263GNG

Broadcom

TELECOM CIRCUIT

FLAT

14

RECTANGULAR

UNSPECIFIED

YES

1

FIBER OPTIC

TIN LEAD

DUAL

R-XDFO-F14

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.