16 Other Function Telecom Interface ICs 595

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1190RGVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	2.5/3.3	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
BM71BLES1FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm			30	260	11.5 mm
EQCO30T5.2	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	.95 mm	4 mm		e4	30	260	4 mm
RN4871-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
RN4871-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
BM71BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
EQCO30R5.D	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
RN4871-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
RN4871-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
EQCO62R20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
CC1190RGVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	2.5/3.3	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
RN4871U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.1 mm	9 mm					11.5 mm
RN4871-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
BGT24LTR11N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-PBCC-B16	1	.77 mm	2.4 mm		e3			2.4 mm
RN4871-V/RM130	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
EQCO62R20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16		1 mm	4 mm		e4			4 mm
EQCO62T20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
CC2592RGVT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
U2270B-MFPY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, LOW PROFILE			1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.4 mm	3.8 mm	Not Qualified	e3		260	9.9 mm
EQCO62T20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm		e4	30	260	4 mm
BM71BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm		e4			11.5 mm
AD9832BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
AD9832BRUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
AS3933-BQFT	Ams Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16	3	.9 mm	4 mm				260	4 mm
TMS3705A1DRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm	Not Qualified	e4	30	260	9.9 mm
TMS3705EDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm		e4	30	260	9.9 mm
CC2592RGVR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
HMC799LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			80 mA	5 V	5	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1			Not Qualified	e3	30	260
AD608ARZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	9.9 mm
HMC244AG16	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE			.76 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-PQFP-G16	1	1.65 mm	5.84 mm		e4	30	250	5.84 mm
TMS3705DDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm		e4	30	260	9.9 mm
HMC1119LP4METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	1 mm	4 mm		e4	30	260	4 mm
ISL32275EFVZ-T	Renesas Electronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	1.2 mm	4.4 mm		e3	30	260	5 mm
AS3933-BTST	Ams Ag	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm				260	5 mm
UJA1023T/2R04/C,512	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
ADL5391ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm	Not Qualified	e3	30	260	3 mm
GS2988-INE3	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N16	3	.9 mm	4 mm		e3	40	260	4 mm
BM71BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-X16		2.1 mm	9 mm					11.5 mm
SST12LF02-QXCE	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N16		.5 mm	3 mm		e3			3 mm
ADL5904ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e4	30	260	3 mm
HMC1094LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm		e3	30	260	3 mm
SE2604L-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N16		.9 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
PE42423MLBA-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e4			3 mm
ONET8501PRGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	NOT SPECIFIED	260	3 mm
MAX9152ESE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MAX9152ESE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	9.9 mm
SA5224D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.035 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
TMS3705BDRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.91 mm	Not Qualified	e4	30	260	9.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.